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IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
IPC has released IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards. This document is the base standard for addendums covering military and space...
ASMPT Introduces MEGA Multi-chip Bonding Platform
ASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new...
Etek Europe Appointed as Official Distributor for GKG SMT Printers.
Etek Europe has been appointed as the official distributor for GKG, a globally recognised manufacturer of advanced SMT solder paste printing solutions. The agreement...
Long-standing Partnership Between ASYS Group & SEW-EURODRIVE: A Success Story: With Future-oriented Handling Systems
For many years, the ASYS Group and SEW-EURODRIVE have enjoyed a close and successful partnership characterized by trust, innovation and joint successes. SEW-EURODRIVE, one...
Variosystems Reinforces Engineering Leadership Team with Markus Dillinger
Variosystems plans to double its revenues by 2026 and, to make that happen, is banking on expansion, boosted employee numbers, and a broader range...
North American PCB Industry Sales Up 6.7 Percent in May
IPC announced today the May 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.89.
Total North American...
Technical Cleanliness as a Quality-Critical Process Parameter in Advanced Packaging
The pace of innovation in the semiconductor industry is increasingly driven by the back end today. Chiplet architectures, 2.5D and 3D packaging, High Bandwidth...
Syensqo at Semicon China 2024 with a Complete Portfolio of Polymer Solutions Advancing Chip...
Syensqo, previously part of Solvay Group, will demonstrate its advanced materials and services across all process needs to the semiconductor manufacturing industry at Semicon...
Austin American Technology Adds NanoJet™ Inline Electronics Cleaning System to Virtual Demo Room
Austin American Technology (AAT) is pleased to announce that it has added the NanoJet™ Inline Electronics Cleaning System to its Virtual Demo Room. The...
Indium Corporation to Feature High-Reliability Products for Power Electronics at APEC
Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at APEC 2022, March 20-24, Houston, Texas, U.S.
Indium Corporation offers a robust...
