Ventec Consolidates and Upgrades European Production and Logistics Center in Germany

Ventec International Group has begun consolidating operations and installing new, state-of-the-art facilities at its European production and logistics hub in Kirchheimbolanden, Germany. Following the PCB...
SHENMAO Introduces SMF-WC58 Water-Soluble Flux for Advanced Semiconductor Packaging

SHENMAO Introduces SMF-WC58 Water-Soluble Flux for Advanced Semiconductor Packaging

SHENMAO TECHNOLOGY is pleased to introduce SMF-WC58, a water-soluble, halogen-free tacky flux developed for ultra-fine bump pitch flip-chip and BGA/CSP attach processes. SMF-WC58 provides strong...

Transition Automation Debuts Squeegee Safe-Storage and Cleaning Tool

Transition Automation, Inc. is pleased to announce Squeegee Buddy, a new tool for SMT printer users to help improve process quality and organization. This...
White Paper Discusses Key Considerations for Electronic Component Tin Whisker Mitigation

White Paper Discusses Key Considerations for Electronic Component Tin Whisker Mitigation

The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use lead-free solder alloys containing...
Indium Corporation Introduces New Global Accounts Team Member

Indium Corporation Introduces New Global Accounts Team Member

Indium Corporation is pleased to announce that Tomás Paulos has joined the company as an Assistant Global Accounts Manager. Paulos is responsible for assisting with...
Indium Corporation’s Sze Pei Lim to Present on Solder Joint Reliability at IMPACT Conference in Taipei

Indium Corporation’s Sze Pei Lim to Present on Solder Joint Reliability at IMPACT Conference...

Indium Corporation Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will be part of a panel presentation at the International...
SAKI’s AI Solution Receives the 2026 NPI Award (Software Category)

SAKI’s AI Solution Receives the 2026 NPI Award (Software Category)

SAKI’s AI Solution has been recognized with the 2026 NPI Award in the Software – Production category. This award highlights technologies that contribute to innovation in...
Indium Corporation to Present Technical Paper at SEMI-THERM

Indium Corporation to Present Technical Paper at SEMI-THERM

Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen will present a technical paper at SEMI-THERM, taking place March 13–17 in San...
Find Out Why Dispensing is Easier with PVA at The Assembly Show

PVA and AlphaGlobal Offer Automated Dispensing at the KPCA Show

PVA, a global supplier of automated dispensing and coating equipment, today announced plans to exhibit with its distributor, AlphaGlobal, at the KPCA Show, scheduled...
Nordson Electronics Solutions to exhibit high-yield fluid dispensing technologies for panel-level and wafer-level packaging at SEMICON Taiwan 2025

Nordson Electronics Solutions to Exhibit High-yield Fluid Dispensing Technologies for Panel-level and Wafer-level Packaging...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September...