KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics

KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics

KONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating...
KOKI Announces Upcoming Webinar on a Residue-Free Soldering Solution for Power Devices Using Formic Acid Reflow

KOKI Announces Upcoming Webinar on a Residue-Free Soldering Solution for Power Devices Using Formic...

KOKI, a global leader in advanced soldering materials and process optimization services, will host a free, live webinar on Thursday, May 29, 2025, at...
CyberOptics WX3000™ Metrology and Inspection system

CyberOptics to Deliver Technical Presentation at the Heterogeneous Integration Summit by SEMICON Taiwan

CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global...

Explore Aven’s Innovative Inspection Solutions at APEX

Aven, a full-service technology provider, is pleased to announce its participation in the upcoming 2024 IPC APEX EXPO, scheduled from April 9-11, 2024, at...
Introducing Jonard Tools' New RocketRibbon® Cable Shaving Tool & Microduct Sheath Slitting Tool

Introducing Jonard Tools’ New RocketRibbon® Cable Shaving Tool & Microduct Sheath Slitting Tool

New Cable Shaving Tool from Jonard Tools Makes It Easy to Get into Thick Jacketed Cables Jonard Tools’ newest cabling tool, the RocketRibbon® Cable Shaving...
IPC logo

James Will to Lead USPAE as New Executive Director

Effective May 28, 2024, James Will joined the U.S. Partnership for Assured Electronics (USPAE) as the association’s new executive director. USPAE is an IPC...
SmartMarker

New: SmartMarker® Creates Unique Identifiers for Plastic Products

Polysecure GmbH and plastics processor Röchling Industrial are launching an exclusive cooperation for the use of innovative marker technology in plastic products. The technology...
Mycronic to showcase new 3D inspection technologies and high-flexibility solutions for zero-defect production at IPC APEX EXPO

Mycronic to Showcase New 3D Inspection Technologies and High-flexibility Solutions for Zero-defect Production at...

As a leading global partner for flexible PCB assembly solutions, Mycronic will continue to respond to growing customer demand for standardized software integration and...
Specialist seminar in Romania: Rehm provides information on Advanced Reflow Soldering and Conformal Coating

Specialist seminar in Romania: Rehm provides information on Advanced Reflow Soldering and Conformal Coating

For the second time, Rehm Thermal Systems, a specialist in the field of thermal system solutions for the electronics industry, invited participants to a...
Riber

New MBE System Order for Industrial Semiconductor Markets

RIBER, a global market leader for molecular beam epitaxy (MBE) equipment serving the semiconductor industry, is announcing an order for a MBE 6000 production...