ITW EAE Announces the Promotion of Joy McKnight to Vice President and General Manager

ITW EAE Announces the Promotion of Joy McKnight to Vice President and General Manager

ITW EAE, a leading manufacturer of high-performance equipment for the electronics assembly and thermal processing industries, is pleased to announce the promotion of Joy...
Indium

Indium Corporation to Feature Proven Products for Advanced Packaging at ECTC

Indium Corporation will feature its innovative products for advanced packaging at Electronic Components and Technology Conference (ECTC), May 31-June 3, in San Diego, Calif.,...

New Adhesive for Automotive Lighting

DELO has developed a new adhesive for automotive lighting applications. DELO PHOTOBOND OB4189 is resistant to yellowing and, with its high aspect ratio, is...
Luminovo Receives 2025 Mexico Technology Award for Electronics Supply Chain Platform

Luminovo Receives 2025 Mexico Technology Award for Electronics Supply Chain Platform

Luminovo, the number one quoting, procurement and collaboration software for the electronics supply chain, is proud to announce that it has won a 2025...
SMTA

Counterfeit Electronics & Materials Symposium Program Announced and Registration Open

The SMTA is excited to announce the technical program for the Counterfeit Electronics & Materials Symposium. The symposium will be held 15-16 April 2025...
Tim Burke CTO Arch

Arch Systems Co-founder Receives IPC Rising Star Award

Arch® Systems, the leading provider of machine data and analytics for electronics assembly operations, is pleased to announce that Tim Burke, CTO and co-founder,...

ECD Engineering Team Expands with Addition of Software Development Engineer

ECD today announced that Seydina Diop has joined the company’s growing engineering team as a Software Engineer II. This is the second ECD engineering...

Brook Anco Corp. Exhibits TAGARNO Digital Microscopes at Design-2-Part Florida

TAGARNO announced that its representative, Brook Anco Corporation, will exhibit at Design-2-Part Florida, scheduled to take place May 2-3, 2023 at the Orlando Convention...
IPC logo

North American PCB Industry Sales Down 3.9 Percent in January

IPC announced today the January 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.93. Total North...
rehm technology centre

Comprehensive Process Analyses for Assemblies

Rehm Thermal Systems is a technology leader for reflow soldering systems with convection or condensation, and drying and coating systems. Since 1990, it has...