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ITW EAE Announces the Promotion of Joy McKnight to Vice President and General Manager
ITW EAE, a leading manufacturer of high-performance equipment for the electronics assembly and thermal processing industries, is pleased to announce the promotion of Joy...
Indium Corporation to Feature Proven Products for Advanced Packaging at ECTC
Indium Corporation will feature its innovative products for advanced packaging at Electronic Components and Technology Conference (ECTC), May 31-June 3, in San Diego, Calif.,...
New Adhesive for Automotive Lighting
DELO has developed a new adhesive for automotive lighting applications. DELO PHOTOBOND OB4189 is resistant to yellowing and, with its high aspect ratio, is...
Luminovo Receives 2025 Mexico Technology Award for Electronics Supply Chain Platform
Luminovo, the number one quoting, procurement and collaboration software for the electronics supply chain, is proud to announce that it has won a 2025...
Counterfeit Electronics & Materials Symposium Program Announced and Registration Open
The SMTA is excited to announce the technical program for the Counterfeit Electronics & Materials Symposium. The symposium will be held 15-16 April 2025...
Arch Systems Co-founder Receives IPC Rising Star Award
Arch® Systems, the leading provider of machine data and analytics for electronics assembly operations, is pleased to announce that Tim Burke, CTO and co-founder,...
ECD Engineering Team Expands with Addition of Software Development Engineer
ECD today announced that Seydina Diop has joined the company’s growing engineering team as a Software Engineer II. This is the second ECD engineering...
Brook Anco Corp. Exhibits TAGARNO Digital Microscopes at Design-2-Part Florida
TAGARNO announced that its representative, Brook Anco Corporation, will exhibit at Design-2-Part Florida, scheduled to take place May 2-3, 2023 at the Orlando Convention...
North American PCB Industry Sales Down 3.9 Percent in January
IPC announced today the January 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.93.
Total North...
Comprehensive Process Analyses for Assemblies
Rehm Thermal Systems is a technology leader for reflow soldering systems with convection or condensation, and drying and coating systems. Since 1990, it has...
