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MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability...
Every advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support...
Tresky Allows Dispensing of Over 100 mm² for Large Area Sintering Applications
The integration of large-area power modules with an area of over 100 mm² is highly relevant. These modules are of great importance for various...
Indium Corporation Announces New Jetting Solder Paste
Indium Corporation® has announced a new jetting solder paste in its line of PicoShot® products. PicoShot® WS-5M is designed for customers needing an SnPb...
Indium Corporation Announces Promotion of Amy Schultz
Indium Corporation is proud to announce that Amy Schultz has been promoted to the position of senior specialist I, based at the company headquarters...
New LSR systems from Wevo: customised solutions for textile coatings and sealing applications
WEVO-CHEMIE GmbH introduces WEVOSIL 23010 and WEVOSIL 23030, two new liquid silicone rubbers (LSRs) specially developed for silicone textile coatings and sealing applications (CIPG/FIPG)....
KYZEN Wins 2025 CIRCUITS ASSEMBLY NPI Award for CYBERSOLV® 141-K in Cleaning Materials Category
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that CYBERSOLV® 141-K has been honored with the 2025 CIRCUITS...
Yamaha Squeegee Innovation Boosts Screen-print Repeatability and Stencil Life
Yamaha Robotics SMT Section has revealed an innovative squeegee design for surface-mount screen printing that raises process performance and extends stencil life.
The new 3SR...
KIC Keeps to its Roots of Customer Service as Part of the Solution, Wins...
KIC is pleased to announce that it has been honored with a 2022 CIRCUITS ASSEMBLY Service Excellence Award (SEA). The award was announced November...
Tresky Offers a Wide Range of Application Options for Ultrasonic DIE Bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s....
SMTA Announces Program for 2026 Ultra High Density Interconnect (UHDI) Symposium
The SMTA is excited to announce the technical program for the 3rd annual Ultra High Density Interconnect Symposium which takes place on April 9,...
