Hentec/RPS Publishes Achieving Greater Through-Hole Soldering Reliability Tech Paper

Hentec/RPS Publishes Achieving Greater Through-Hole Soldering Reliability Tech Paper

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing...
Amtech Launches BOMsense™ Free Online Tool to Help Manufacturers Reduce Tariff Risk and BOM Surprises

Amtech Launches BOMsense™ Free Online Tool to Help Manufacturers Reduce Tariff Risk and BOM...

Amtech Electrocircuits, a leading provider of manufacturing solutions, is proud to announce the release of BOMsense™, a free, Web-based tool that gives engineers, buyers,...
Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President

Promex Industries and QP Technologies Implement Sales/Marketing Reorganization

Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, and its San Diego-based division QP Technologies, a leading provider...
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application

The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application

The Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework...

QP Technologies™ Achieves ANSI/ESD S20.20 Certification

QP Technologies™, a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has been certified ANSI/ESD S20.20-compliant by TÜV SÜD America...
KYZEN to Showcase MICRONOX MX2123 Power Module Cleaner at IMAPS Device Packaging Conference 2025

KYZEN to Showcase MICRONOX MX2123 Power Module Cleaner at IMAPS Device Packaging Conference 2025

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on...
Mycronic

Mycronic Receives Order for an SLX Mask Writer

Mycronic AB (publ) has received an order for an SLX mask writer from a new customer in Asia. The order value is in the...
IPC logo

Electronics Industry Continues to Show Resiliency Despite Rising Labor Costs and Recruiting Difficulties

According to IPC’s January Sentiment of the Global Electronics Manufacturing Supply Chain report, 75 percent of electronics manufacturers are experiencing rising material costs, while...

KemLab Inc. Offers HARP™ PMMA and Copolymer e-Beam Resists for High-Resolution Lithography Applications

KemLab Inc., a pioneering developer of advanced materials for microelectronics and MEMS applications, is pleased to offer a high-quality solution tailored to address the...
Tresky expands digital service support with Pink Flamingo

Tresky expands digital service support with Pink Flamingo

The Pink Flamingo document management and support system offers a wide range of possibilities for servicing machinery and equipment. Tresky GmbH uses Pink Flamingo...