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Microscreen Welcomes Kristy Jackson as Senior Marketing Manager
Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, has named Kristy Jackson, MBA, its new Senior Marketing Manager....
PVA Launches DeltaFlex™, a Large-Format Coating and Dispensing Platform for Complex Manufacturing Applications
PVA, a global supplier of automated dispensing and coating equipment, announced the launch of the DeltaFlex™, a next-generation large-format dispensing and coating platform engineered...
Dymax Launches BlueWave® FX Line Emitters to Boost Throughput in High-Speed Linear UV/Visible Curing
Dymax, a global manufacturer of light-curing adhesives and equipment, today announced the BlueWave® FX Line Emitter series, purpose-built to deliver fast, uniform linear UV/Visible...
Microscreen and AGI Corporation Launch MAA, Expanding Capabilities for Both Companies
Microscreen and AGI Corporation have formed the Microscreen AGI Alliance (MAA). The alliance adds AGI’s PCB tooling and engineering capabilities to Microscreen’s offerings, while...
Microscreen Opens New Stencil Manufacturing Facility in Oxford, Connecticut
Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, is pleased to announce the opening of its newest facility...
Plasmatreat Sets Course for Future Requirements: New Leadership Team Expands Technology Portfolio
With an expanded technology portfolio, Lukas and Magnus Buske and their teams are positioning Plasmatreat to meet future demands in industrial surface treatment. AURORA-Plasma...
Less Heat, More Speed: DELO Pushes Low Temperature Curing Further
A new generation of super low temperature (SLT) curing adhesives enables reliable bonding in consumer electronics assembly at temperatures as low as 45°C, significantly...
Dymax to Demonstrate Light-Curing Technologies for Electronics Assembly at the APEX EXPO 2026
Dymax,a global manufacturer of light-curing materials and equipment, will exhibit at APEX EXPO 2026, held March 17–19, 2026, at the Anaheim Convention Center in...
Data I/O and IAR Announce Collaboration to Simplify and Unify Security Provisioning from Embedded...
Data I/O Corporation (NASDAQ: DAIO), the leading global provider of data provisioning solutions for flash memory, microcontrollers and security ICs, and IAR, the global...
Seica at 2026 APEX EXPO, a Powerhouse of Smart Innovation, High Performance and Integrated...
Seica, Inc. will return to the APEX EXPO, taking place March 17–19, 2026, at the Anaheim Convention Center, where the company will present its...
