Mycronic Receives Order for an SLX Mask Writer

Mycronic Receives Order for an SLX Mask Writer

Mycronic AB has received an order for an SLX mask writer from a new customer in Asia. The order value is in the range...
Indium Corporation’s Theo Ruas Promoted to Global Sales Manager, Metals and Compounds

Indium Corporation’s Theo Ruas Promoted to Global Sales Manager, Metals and Compounds

Indium Corporation is pleased to announce that Theo Ruas has been promoted to the role of Global Sales Manager, Metals and Compounds. In his new...
Electrolube Launch Range of Silver Conductive Inks for LCD, LCM and OLED Display Applications at C-Touch & Display China

Electrolube Launch Range of Silver Conductive Inks for LCD, LCM and OLED Display Applications...

Electrolube, global manufacturer of specialist electro-chemical solutions, has announced the launch of a brand-new series of silver conductive inks for multiple adhesive processes designed...
David Socha Indium Indium Corporation Expert to Present on Innovative Metal 3D Additive Manufacturing Technology at TCT Conference @ Formnext

Indium Corporation Expert to Present on Innovative Metal 3D Additive Manufacturing Technology at TCT...

Indium Corporation’s David Socha, technology assessment manager, will present on Indium Corporation’s innovative 3D-EZ-Release™ build plate, a cutting-edge technology that allows for the quick...
Mycronic Receives Order for an SLX Mask Writer

Mycronic Receives Order for Two SLX Mask Writers

Mycronic AB has received an order for two SLX mask writers from an existing customer in Asia. The order value is in the range...
Indium Corporation to Feature Innovative Products for EV, Mobile, and Semiconductor Applications at productronica India

Indium Corporation Showcasing Innovative Products at Several China-Based Conferences

Indium Corporation® will be showcasing its innovative products and technology throughout the China market at five industry tradeshows in October and November. The award-winning...
Perfect connection

Perfect Connection

The die-to-die bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW). Ultrasonic welding can reduce bonding pressure and temperature. This...
Indium Corporation’s Sze Pei Lim to Present on Solder Joint Reliability at IMPACT Conference in Taipei

Indium Corporation’s Sze Pei Lim to Present on Solder Joint Reliability at IMPACT Conference...

Indium Corporation Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will be part of a panel presentation at the International...
Triplett Announces EPC600 Environmental Particle Counter for Indoor Air Quality Monitoring

Triplett Announces EPC600 Environmental Particle Counter for Indoor Air Quality Monitoring

Triplett Test Equipment, a leading maker of test equipment tools, announces the Triplett Model EPC600 Environmental Particle Counter, a compact and portal tool ideal...
BTU Partners with iRaptor to Offer Advanced Profiling Technology

BTU Partners with iRaptor to Offer Advanced Profiling Technology

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced a new strategic partnership with iRaptor...
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