Bondtec

Top-quality Wire Bonding Connections Guaranteed Thanks to QuattroClean Snow-jet Cleaning

Ultrasonic wire bonding has been established as a contacting method in the microelectronics and semiconductor industry for many years. The technology is also ideally...
kodiak assy

Kodiak Assembly Solutions Helps Customer Build Award-Winning Tech

Kodiak Assembly Solutions LP, a leading contract electronic manufacturer, announces that its longtime customer, NXP Semiconductors, was awarded “Best in Show” at Embedded World...
shenmao

SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional...

EY Announces Dr. Subodh Kulkarni of CyberOptics Corporation as an Entrepreneur Of The Year®...

Ernst & Young LLP (EY US) announced that Dr. Subodh Kulkarni, President and CEO of CyberOptics, was named an Entrepreneur Of The Year® 2022...
Scott K Boston

Boston Semi Equipment Names Semiconductor Industry Veteran Scott Kroeger as Senior Vice President Sales...

Boston Semi Equipment (BSE) today announced that it has named Scott Kroeger as senior vice president, Sales and Marketing. He brings decades of executive...
indium at imaps

Indium Corporation to Feature Proven Products at iMAPS SiP Conference

Indium Corporation will feature products from its portfolio of system-in-package material solutions at the Advanced System in Package Technology Conference & Exhibition, organized by...

PVA Receives Patent for New Optical Bonding Method

PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce that it received a new patent in Japan for “optical...
NC-809

Indium Corporation Introduces New Ultra-Low Residue Flip-Chip Flux at ECTC

Indium Corporation® will introduce NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC), May 31-June 3, San...

Indium Corporation Expert to Present at iMAPS SiP Conference

Indium Corporation’s Strategic Advisor Dr. Dongkai Shangguan will share his technical insight and expertise on advanced packaging at the Advanced System in Package Technology...
DUPONT RIBBON CUTTING

DuPont Opens New Kapton® and Pyralux® Production Line in Circleville, Ohio

DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, recently held a ribbon-cutting ceremony with elected officials and business leaders to formally...
This website uses cookies and asks your personal data to enhance your browsing experience.