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    Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1

    Wendy Tindle -
    The Electronics Manufacturing & Assembly Collaborative (EMAC) today announced the Round 1 results of the Bright Electronics Manufacturing Challenge 2026, and for the first...
    Global Electronics Association

    North American EMS Orders Surge in July as Book-to-Bill Stands at 1.29

    Wendy Tindle -
    The Global Electronics Association announced today the July 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands...

    BTU International Introduces Aurora Vacuum™ Reflow Oven for High-Volume, High-Yield Electronics Manufacturing

    TRI at the IPC CFX Smart Factory Demo Line at FBC ASEAN 2026

    CE3S Recognizes Amanda Smeltz’s Leadership with Promotion to Vice President of Commercial Growth & Strategy

    VJ Electronix Appoints Process Automation & Tool as Southeast Representative

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    Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1

    Wendy Tindle -
    The Electronics Manufacturing & Assembly Collaborative (EMAC) today announced the Round 1 results of the Bright Electronics Manufacturing Challenge 2026, and for the first...

    BTU International Introduces Aurora Vacuum™ Reflow Oven for High-Volume, High-Yield Electronics Manufacturing

    Wendy Tindle -
    BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced the launch of the Aurora Vacuum™...

    TRI at the IPC CFX Smart Factory Demo Line at FBC ASEAN 2026

    Wendy Tindle -
    Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will participate as a key technology partner in...

    Indium Corporation to Showcase High-Reliability Power Device Packaging Solutions at PCIM Asia 2026

    Wendy Tindle -
    As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products that are “Electrifying the Future”...

    Seika Machinery’s SMI 2026 Webinar Series Continues with Focus on Moisture-Device Storage

    Wendy Tindle -
    Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will present the fifth session of its SMI 2026 Summer Webinar...
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