Issue 56 | Jan/Feb 2023
Inside this issue
Cover Feature | Small Data, Big Challenges: Journey to realize AI for our industry By Dr. Brian Kang and Sarah Chi, Marketing Specialist, Koh Young Technology
Shows/Events
-
IPC APEX EXPO 2023 | San Diego Convention Center, CA
Technology Today
- Process Capabilities and Application of Modern SMT Dispensing
- Expert Insights Open the Doorway to Combating Chip Shortages for Electronics Manufacturers
- Weller Continues Connecting the Future of Soldering with the Launch of the WXsmart Soldering Platform
- StenTech Solves Stencil Challenges by Focusing on Customer Needs
- CEO Says a Pivotal Packaging Change Decreased Packaging Costs by 90%
- Scienscope’s X-Scope 1800 Provides Advanced Inspection Capabilities to Rocket EMS’s New Nevada Facility
- Software Innovations Bring Data-Driven Improvement to Surface-Mount Assembly
- Thick Film – a Mature Technology at the Cutting Edge of Advances in the Electronics Industry
Industry News and Much More!
