Issue 56 | Jan/Feb 2023

Inside this issue

Cover Feature | Small Data, Big Challenges: Journey to realize AI for our industry By Dr. Brian Kang and Sarah Chi, Marketing Specialist, Koh Young Technology


  • IPC APEX EXPO 2023 | San Diego Convention Center, CA

Technology Today

  • Process Capabilities and Application of Modern SMT Dispensing
  • Expert Insights Open the Doorway to Combating Chip Shortages for Electronics Manufacturers
  • Weller Continues Connecting the Future of Soldering with the Launch of the WXsmart Soldering Platform
  • StenTech Solves Stencil Challenges by Focusing on Customer Needs
  • CEO Says a Pivotal Packaging Change Decreased Packaging Costs by 90%
  • Scienscope’s X-Scope 1800 Provides Advanced Inspection Capabilities to Rocket EMS’s New Nevada Facility
  • Software Innovations Bring Data-Driven Improvement to Surface-Mount Assembly
  • Thick Film – a Mature Technology at the Cutting Edge of Advances in the Electronics Industry

Industry News and Much More!