Seica to Showcase Latest Innovations at SEMICON WEST

Seica to Showcase Latest Innovations at SEMICON WEST

Seica, a global leader in advanced electronic test solutions, will showcase its latest innovations for the semiconductor industry at SEMICON West, taking place October...
Koh Young Europe Highlights Smart AI Solutions at EFX Stuttgart

Koh Young Europe Highlights Smart AI Solutions at EFX Stuttgart

Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6...
Indium Corporation Promotes Hongwen Zhang to Research and Development Director

Indium Corporation Promotes Hongwen Zhang to Research and Development Director

Indium Corporation has promoted Hongwen Zhang, Ph.D., to Research and Development (R&D) Director. In this role, he will lead technology development, product road-mapping, and...
SEHO Systems Strengthens Its Position in India with NMTronics Partnership

SEHO Systems Strengthens Its Position in India with NMTronics Partnership

SEHO Systems GmbH is expanding its presence in the Indian electronics manufacturing market through a new strategic partnership with NMTronics India Pvt. Ltd. The...
Trymax Secures Multi-Million-Dollar Supply Agreement with AOI to Support InP Laser Manufacturing

Trymax Secures Multi-Million-Dollar Supply Agreement with AOI to Support InP Laser Manufacturing

Trymax Semiconductor Equipment (“Trymax”), a specialist manufacturer of plasma- and UV-based solutions for the semiconductor and optoelectronics industries, today announced that it has been...
BTU Introduces Advanced Formic Acid Reflow Capability for Fluxless Semiconductor Packaging

BTU Introduces Advanced Formic Acid Reflow Capability for Fluxless Semiconductor Packaging

BTU International, a leading supplier of advanced thermal processing equipment for the electronics manufacturing and semiconductor industries, today announced the availability of an advanced...
Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026,...
Nordson Electronics Solutions introduces the new ASYMTEK Vantage® XL precision fluid dispensing system for panel-level packaging (PLP) during semiconductor manufacturing at SEMICON Taiwan 2026.

Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL fluid dispensing system for panel-level...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address...
WEISUN - FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

WEISUN – FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

Taiwanese thermal processing equipment maker WEISUN Industrial Co., Ltd. has added a dedicated 310 x 310mm configuration to its AQWOL-5S Smart Clean Room and...
Green Circuits Appoints Kirk Knudsen as Vice President of Procurement to Strengthen Supply Chain Operations

Green Circuits Appoints Kirk Knudsen as Vice President of Procurement to Strengthen Supply Chain...

Green Circuits, an electronics manufacturing services (EMS) provider serving OEMs across aerospace and defense, medical, industrial, semiconductor and AI hardware markets, has appointed Kirk...