Nihon Superior Introduces Lead-Free Solder Paste for Automotive Requirements

Nihon Superior Introduces Lead-Free Solder Paste for Automotive Requirements

Nihon Superior Co. Ltd., a supplier of advanced joining materials, is pleased to introduce its LF-C2 Lead-Free Solder Paste. Designed for automotive applications, LF-C2...
Arch Systems, HARMAN and FORVIA HELLA representatives on stage at Automotive News Congress 2026 AI panel

Arch Systems, HARMAN and FORVIA HELLA to Headline AI-in-Manufacturing Panel at Automotive News Congress...

Arch Systems, the manufacturing intelligence platform powering AI agents on factory shop floors, announced that two automotive manufacturers it is working with, HARMAN Automotive...
PVA 2164 FC100-CF Spray CU 2

PVA to Participate in the PB Technik Meets Friends Seminar

PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce plans to participate in the PB Technik Meets Friends Seminar,...
Shenmao

High Thermal Impact Reliability BGA Sphere from SHENMAO

SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile...
HARTING expands SPE infrastructure range

HARTING Expands SPE Infrastructure Range

HARTING has launched an expanded range of products to support and boost its Single Pair Ethernet (SPE) infrastructure. Semiconductor PHY chipsets, magnetics, cable and...

J.A.M.E.S Unveils New Website to Showcase and Promote Knowledge of AME Technology

J.A.M.E.S, a frontrunner in the field of Additively Manufactured Electronics (AME), is pleased to announce the launch of its new website. Following insightful feedback...

PICMG Bolsters New COM-HPC “Mini” Form Factor with Release of Carrier Design Guide Revision...

PICMG®, a consortium for open hardware specifications, has released revision 2.2 of the COM-HPC® Carrier Design Guide. This comprehensive document contains interface schematics, diagrams,...
RBB to Discuss Custom PCB Assembly Solutions at PCB Detroit

RBB to Discuss Custom PCB Assembly Solutions at PCB Detroit

RBB, a trusted leader in electronics manufacturing since 1973, is excited to announce its participation in PCB Detroit, taking place June 2–3, 2025, at...
‘Wir gehen in die Tiefe’ seminar, 2019 (image: Rehm Thermal Systems)

Face-to-face events again at last!

Rehm Thermal Systems to appear at the EPP InnovationsFORUM and ‘Wir gehen in die Tiefe’ They’re back. The first face-to-face events for a long time...
smartsol

SMarTsol Technologies Opens Nordson TEST & INSPECTION Lab in Mexico

SMarTsol Technologies, a technical services and equipment provider for Mexico and the US, today announced that it has opened its new Nordson TEST &...