Incap Corporation

Incap Corporation Acquires Lacon Group, Strengthening its Position in the Fast-growing Defense Sector and...

Incap Corporation, a globally operating Electronics Manufacturing Services (EMS) company with headquarters in Finland, has signed on 3 December 2025 an agreement to acquire...
Shenmao APEX 22

SHENMAO to Highlight High-Rel Solder Sphere and Thermal Fatigue Resistant Paste at APEX

SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan....
PCB West 2026 Booth Space Now Open to Any Exhibitor

PCB West 2026 Booth Space Now Open to Any Exhibitor

The exhibition floor for PCB West 2026 is now open to any prospective exhibitor, the Printed Circuit Engineering Association (PCEA) announced today. The exhibit...
delo adhesives

DELO Publishes Wide Range of Webinars on Bonding Technology

DELO will host half a dozen webinars in the first half of 2022. Various aspects of the joining process will be covered, from the basics...
Modular Platform with Epoxy Bonding, Laser Welding, and Selective Laser Soldering for Hybrid Optoelectronic Components

Modular Platform with Epoxy Bonding, Laser Welding, and Selective Laser Soldering for Hybrid Optoelectronic...

The assembly of optoelectronic components requires maximum precision and permanently stable connections. With NanoHybrid, nanosystec offers a modular platform that combines epoxy bonding, laser...
Mahogany Board Unigen

Unigen Introduces PCIe Gen 4 Switch Evaluation Kit in Collaboration with Microchip

Unigen Corporation today announced the availability of its PCIe Gen 4 Switch Evaluation Kit (EVK) based on Microchip’s industry-leading SwitchtecTM product. The “Mahogany” EVK...
Fuji Succeeds in World-First 016008 mm (006003") Component Placement

Fuji Succeeds in World-First 016008 mm (006003″) Component Placement

Fuji Corporation (headquarters: Chiryu, Aichi; Representative Director, President and CEO: Joji Isozumi; hereinafter referred to as "Fuji") is pleased to announce that it has...
Data IO Ed Smith

Data I/O Announces Appointment of Edward Smith to Board of Directors

Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced data and security deployment solutions for flash, flash-memory based intelligent devices and microcontrollers,...
Aegis Software Completes Acquisition of Simio

Aegis Software Completes Acquisition of Simio

Aegis Software ("Aegis"), a global provider of manufacturing execution and operations software for diverse manufacturing industries, announced today that it has completed the acquisition...

Nordson Electronics Solutions Offers their Latest Dispensing, Conformal Coating, and Selective Technologies at SMTConnect...

Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will showcase the latest dispensing, conformal coating, and selective soldering equipment for printed circuit...