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Automating Wedge Bonding for Complex Wire Components
RF and mmWave specialist, Filtronic has further enhanced its hybrid and semiconductor packaging capabilities by investing in a fully automated wedge bonder suitable for...
IPC Introduces New Committee Leader and Committee Volunteer Awards at IPC APEX EXPO 2023
In keeping with its commitment to showing appreciation for its strong volunteer community, IPC introduced two new awards in IPC standards development at IPC...
Yamaha Praises Sales Partners’ Strong Performances at Annual Distributor Meeting
Yamaha Motor Robotics Business, SMT Section held its annual distributor meeting at the Company headquarters in Neuss, Germany, February 7-9. Partners from across the...
PVA Solidifies Optical Bonding Expertise with New Patent
PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce that it has been awarded a new patent for optical...
Silicon Mountain Invests in Four Pillarhouse Selective Solder Systems
Silicon Mountain, a leading electronic manufacturing company, has upgraded its selective soldering department with four new selective solder systems from Pillarhouse International. The company...
Creation Technologies Doubles Production Capacity at St. Peter, MN Facility
Creation Technologies, an end-to-end, scalable Global Electronic Manufacturing Services provider, today announced the completion of its facility expansion in St. Peter, MN. With the...
Aven offers E-Z Pik tweezers with durable coating for high visibility and easy identification
Aven, a full-service technology provider, is pleased to offer E-Z Pik tweezers, designed with a highly durable special coating for high visibility and easy...
TT Electronics Named a 2023 Best of Sensors Awards Finalist
TT Electronics, a global provider of engineered technologies for performance critical applications, today announces it has been named a finalist in the Industrial Sensors...
Indium Corporation to Feature Products for HIA and SiP at CHIPcon
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative...
Hirose Launches World’s Smallest Width Multi-RF Board-to-Board Connector
Hirose has released a multi-RF board-to-board connector that provides a size reduction of up to 71% compared to conventional designs. With the industry’s smallest...
