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MacDermid Alpha Electronics Solutions Announces Agreement to Acquire Micromax®
Element Solutions Inc, the parent company of MacDermid Alpha Electronics Solutions, announced today that it has signed a definitive agreement to acquire Micromax®, a...
Titanium Solder Mask Technology from Eutect for Precision and Process Stability in Modern Selective...
At this year's productronica in Munich, Eutect GmbH will present its latest generation of titanium solder masks for selective soldering. The custom-made masks are...
MacDermid Alpha Expands Laboratory Facilities in Thailand to Strengthen Regional Innovation and Customer Collaboration
MacDermid Alpha Electronics Solutions, a global leader in chemicals and materials for electronic manufacturing, today announced the opening of its expanded laboratory in Bangkok,...
Indium Corporation Expert to Present on Advancing Thermal Performance at TestConX China
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on...
SolderKing Earns Bronze EcoVadis Medal for Second Consecutive Year
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, has announced the launch of its new Nippon Nozzle division, dedicated...
SolderKing Earns Bronze EcoVadis Medal for Second Consecutive Year
SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has been awarded a Bronze Medal by EcoVadis for the second...
SHENMAO Unveils Low-Temperature Solder Paste for Reliable AI Server Cooling Assembly
As artificial intelligence continues to reshape data centers and high-performance computing, server thermal management has become more demanding than ever. To support the next...
Teknek to Unveil Latest Tek-BC Board Cleaner at Productronica 2025
Glasgow-based Teknek (ITW Inc.), the pioneer of contact cleaning technology, has chosen Productronica 2025 in Munich, to launch a significant range extension to its...
YINCAE Launches UF 66L Optical Clear Underfill for High-Reliability Silicon Photonics and Optoelectronic Packaging
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors,...
Precise Titanium Solder Masks and Workpiece Carriers
Titanium soldering masks and workpiece carriers play a central role in the selective soldering process. Eutect develops these masks and carrier systems individually according...
