AIM to Highlight Cost-Saving Low Silver REL61 Alloy at SMTA Michigan Expo & Tech Forum

AIM to Highlight Cost-Saving Low Silver REL61 Alloy at SMTA Michigan Expo & Tech...

AIM Solder is pleased to announce its participation in the upcoming SMTA Michigan Expo and Tech Forum. This event takes place August 18 at...
Precision Micro sees semiconductor revenue surge as AI drives manufacturing demand

Precision Micro sees semiconductor revenue surge as AI drives manufacturing demand

~ Chemical etching specialist reports 43 per cent growth as semiconductor supply chains scale for AI and advanced computing ~ Chemical etching specialist, Precision Micro...
Dymax Launches 9310 Adhesive for High-Reliability PCB Reinforcement

Dymax Launches 9310 Adhesive for High-Reliability PCB Reinforcement

Dymax, a global manufacturer of light-curing materials and equipment, announces the launch of its 9310 adhesive engineered to reinforce fine-pitch, leadless components on printed...
PLUS Insights at EFX (6 – 8 October 2026, Stuttgart): The expert forum from trade journal PLUS will be taking place on the EFX Stage. | Copyright: Franziska Kraufmann / Messe Stuttgart

PLUS Insights at EFX: Lecture Programme Now Finalised

“PLUS Insights”, the expert forum for electronics manufacturing at the Expo for Electronics Manufacturing (EFX), taking place in Stuttgart from 6 to 8 October...
KYZEN’s Chelsea Jewell Named to SMTA Next Gen 10 List of Emerging Electronics Industry Leaders

KYZEN’s Chelsea Jewell Named to SMTA Next Gen 10 List of Emerging Electronics Industry...

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that Chelsea Jewell, who serves as Manager of the KYZEN...

POLYN Technology and ALTER TECHNOLOGY France Establish Joint Chip Validation Lab

POLYN Technology, a developer of application-specific neuromorphic analog signal-processing (NASP™) chips, today announced a partnership with ALTER TECHNOLOGY France to establish a joint chip-validation...

Indium Corporation Expert to Present TIMs Solutions for AI Thermal Challenges at IMAPS...

Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will present research on the use of thermal interface materials (TIMs) to...

Bio-based Multi-purpose Adhesive With Excellent Adhesion

DELO has developed an adhesive that consists primarily of bio-based components and combines performance with sustainability. DELO PHOTOBOND SJ4192 is characterized by excellent moisture...
MacDermid Alpha Introduces ALPHA® OM-377 Solder Paste for Reliable Ultra-Fine Feature Printing at Production Scale

MacDermid Alpha Introduces ALPHA® OM-377 Solder Paste for Reliable Ultra-Fine Feature Printing at Production...

MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistry solutions for the electronics industry, announced the launch of ALPHA® OM-377, a...
AIM Hires Marcus Pee as Sales Engineer for Southeast Asia

AIM Hires Marcus Pee as Sales Engineer for Southeast Asia

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Marcus Pee Nai...