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PLUS Insights at EFX: Lecture Programme Now Finalised
“PLUS Insights”, the expert forum for electronics manufacturing at the Expo for Electronics Manufacturing (EFX), taking place in Stuttgart from 6 to 8 October...
KYZEN’s Chelsea Jewell Named to SMTA Next Gen 10 List of Emerging Electronics Industry...
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that Chelsea Jewell, who serves as Manager of the KYZEN...
POLYN Technology and ALTER TECHNOLOGY France Establish Joint Chip Validation Lab
POLYN Technology, a developer of application-specific neuromorphic analog signal-processing (NASP™) chips, today announced a partnership with ALTER TECHNOLOGY France to establish a joint chip-validation...
Indium Corporation Expert to Present TIMs Solutions for AI Thermal Challenges at IMAPS...
Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will present research on the use of thermal interface materials (TIMs) to...
Bio-based Multi-purpose Adhesive With Excellent Adhesion
DELO has developed an adhesive that consists primarily of bio-based components and combines performance with sustainability. DELO PHOTOBOND SJ4192 is characterized by excellent moisture...
MacDermid Alpha Introduces ALPHA® OM-377 Solder Paste for Reliable Ultra-Fine Feature Printing at Production...
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistry solutions for the electronics industry, announced the launch of ALPHA® OM-377, a...
AIM Hires Marcus Pee as Sales Engineer for Southeast Asia
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Marcus Pee Nai...
Indium Corporation to Feature AuLTRA® Die-Attach Solutions at IMS 2026
As an industry leader in innovative materials solutions for critical RF/microwave applications, Indium Corporation® will highlight its high-reliability, gold-based precision die-attach preforms at the...
Indium Corporation to Highlight Power Device Packaging Solutions at ECTC 2026
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of products at the...
DELO Introduces Next-Generation Light-Activatable Adhesives for High-Volume LiDAR Production
DELO, a leading manufacturer of high-tech adhesives, has introduced a new generation of light-activatable adhesives specifically developed for high-volume LiDAR system production. The breakthrough...
