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Advancing Power Electronics Cleaning: KYZEN Wins 2026 EM Innovation Award for MICRONOX® MX2123
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, proud to announce that it has received a 2026 EM Innovation Award in the...
Indium Corporation Indium12.9HF Receives New Product Introduction Award
Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective, low-silver alloys, including SAC105...
KOKI Europe Highlights S3X58-HF1200 Lead-Free Solder Paste for Low Voiding, Stable Reflow Performance, and...
KOKI Europe, a global leader in advanced soldering materials, is highlighting the capabilities of its S3X58-HF1200 lead-free solder paste, a high-performance SMT material engineered...
EFX Taking Shape: Hall Plan, Programme, Highlights
Seven months before EFX kicks off in October and the new industry event for electronics manufacturing is starting to take shape. Over 100 companies...
Indium Corporation to Spotlight Thermal Innovations Enabling Next-Generation AI Systems at Productronica China...
As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation® will showcase its AI-enabling product...
Indium Corporation Presents Cost-Effective Copper Sinter Solutions for Power Electronics at APEC 2026
Indium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance, while addressing power...
Indium Corporation to Feature Materials Solutions Powering Sustainability at APEC 2026
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at APEC 2026, March 22-26,...
AIM to Highlight Cost-Saving Low Silver REL61 Alloy at SMTA Dallas Expo & Tech...
AIM Solder is pleased to announce its participation in the upcoming SMTA Dallas Expo and Tech Forum. This event takes place April 7 at...
AdvancedPCB Promotes Industry Veteran John Stine to Chief Technology Officer
AdvancedPCB today announced the promotion of John Stine to Chief Technology Officer (CTO). A widely respected figure in the PCB industry, Stine has nearly...
SolderKing Expands Solder Paste Range with SAC0307 Low-Silver Alloy Option
SolderKing Assembly Materials has launched SAC0307, a new low-silver addition to its SK P2-5 solder paste range. The new product enables manufacturers to review...
