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Dymax to Demonstrate Light-Curing Technologies for Electronics Assembly at the APEX EXPO 2026
Dymax,a global manufacturer of light-curing materials and equipment, will exhibit at APEX EXPO 2026, held March 17–19, 2026, at the Anaheim Convention Center in...
Indium Corporation Engineer Examines Key Factors Impacting Improvements in Metal TIMs at TestConX 2026
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa, Arizona.
The session, The...
Join AIM Solder and Other Industry Leaders at PARMI’s AI-Focused Tech Days 2026
AIM Solder invites you join us at PARMI’s AI-Focused Tech Days 2026. This event takes place February 25–26 from 10:00 a.m. to 4:30 p.m....
Element Solutions Inc Completes Acquisition of Micromax® Business
Element Solutions Inc (ESI) today announced the completion of its acquisition of the Micromax conductive pastes and inks business, effective February 2, 2026. Micromax...
Indium Corporation to Feature Precision Gold Solder Solutions at MD&M West 2026
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, February 3-5, in Anaheim, Calif. AuLTRA® MediPro is a family...
AIM Solder Appoints Angel Lopez as Technical Support Engineer in North America
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Angel Lopez as...
Indium Corporation to Highlight FAST Soldering Technology at NEPCON Japan 2026
Indium Corporation® will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo.
The company will...
SHENMAO Launches High-Performance Jet Dispensing Solder Paste
SHENMAO Technology, Inc. has introduced PF606-P266J, a high-performance solder paste engineered specifically for jet dispensing processes. Designed to meet the demands of next-generation, non-contact...
Indium Corporation Brings Precision Au-Based Die-Attach Preforms to SPIE Photonics West
Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January 20-22, in San Francisco, California.
Indium...
Microscreen Welcomes Industry Veteran Ed Nyhus as Sales Representative for the Northeast Region
Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, continues to expand its customer support network as demand grows...
