SMT 158D8

World’s First Commercially Available Diamond Filled Underfill: SMT 158D8

YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast flowing, and an...
MACDERMID ALPHA NEPCON CHINA

MacDermid Alpha Receives Best Presentation of Technology Award at SMTA China East Technical Conference

The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, has received ‘The Best...

Electrolube’s ER2223 Resin Protects Stator in Next Generation E-Vehicles

Electrolube, the global manufacturer of electro-chemicals, has successfully developed a solution to protect the stator for a new generation of electric vehicles. The project...
pva dynamax

PVA Announces New Partnership with Dymax

PVA, a global supplier of automated dispensing and coating application systems, today announced that it is now an official distributor of Dymax light-curable adhesives,...
indium corp

Indium Corporation to Feature High-Reliability Products for Power Electronics at APEC

Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at APEC 2022, March 20-24, Houston, Texas, U.S. Indium Corporation offers a robust...
Ventec

Ventec to Host Live Webinar on Thermal Management with IMS

Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that it will be hosting a live webinar on ‘Top design techniques for...
SCS heat

Specialty Coating Systems Introduces IR Thermal Preheating & Curing Systems

Specialty Coating Systems (SCS) is pleased to introduce its new PrecisionHeat infrared radiation (IR) thermal preheating system and PrecisionCure TC IR thermal curing system....
Indium Corporation Introduces New Talent Acquisition Supervisor Nate Discavage

Indium Corporation Introduces New Talent Acquisition Supervisor Nate Discavage

Indium Corporation is pleased to announce that Nate Discavage has joined the company as a talent acquisition supervisor.   In this role, Discavage is responsible...
Indium Corporation’s Miloš Lazić Joins Thermal Interface Materials Team

Indium Corporation’s Miloš Lazić Joins Thermal Interface Materials Team

Indium Corporation is pleased to announce that Miloš Lazić has assumed a new role as Product Development Specialist for Thermal Interface Materials (TIMs). In his...
Indium Corporation to Feature Gold Products at HiTEC

Indium Corporation to Feature Gold Products at HiTEC

As one of the industry’s foremost providers of Au-based products, Indium Corporation® will proudly feature its high-temperature and high-reliability gold solder solutions at the...