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Ventec to Host Live Webinar on Thermal Management with IMS
Ventec International Group Co., Ltd. (6672 TT) is pleased to announce that it will be hosting a live webinar on ‘Top design techniques for...
Specialty Coating Systems Introduces IR Thermal Preheating & Curing Systems
Specialty Coating Systems (SCS) is pleased to introduce its new PrecisionHeat infrared radiation (IR) thermal preheating system and PrecisionCure TC IR thermal curing system....
Indium Corporation Introduces New Talent Acquisition Supervisor Nate Discavage
Indium Corporation is pleased to announce that Nate Discavage has joined the company as a talent acquisition supervisor.
In this role, Discavage is responsible...
Indium Corporation’s Miloš Lazić Joins Thermal Interface Materials Team
Indium Corporation is pleased to announce that Miloš Lazić has assumed a new role as Product Development Specialist for Thermal Interface Materials (TIMs).
In his...
Indium Corporation to Feature Gold Products at HiTEC
As one of the industry’s foremost providers of Au-based products, Indium Corporation® will proudly feature its high-temperature and high-reliability gold solder solutions at the...
Indium Corporation to Feature Products for HIA and SiP at CHIPcon
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative...
Seika Machinery Announces Special Sale on McDry DXU-580UF Feeder Storage Cabinet
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce a special sale on the McDry DXU-580UF...
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1,...
AIM Solder Joins International Electronics Manufacturing Initiative (iNEMI)
AIM Solder, a leading global manufacturer of solder assembly materials, is proud to announce its membership with the International Electronics Manufacturing Initiative (iNEMI). This...
LPKF Builds Partner Network to Innovate Glass Substrate Production for Semiconductor Packaging
Using glass substrates for advanced packaging and heterogeneous integration represents a major shift in the current semiconductor market and one of the biggest challenges...
