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AIM to Highlight Cost-Saving Low Silver REL61 Alloy at SMTA Ohio Valley Expo &...
AIM Solder is pleased to announce its participation in the upcoming SMTA Ohio Valley Expo and Tech Forum. This event takes place August 20...
MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding...
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of...
MicroCare Announces the Appointment of a New Chief Financial Officer
MicroCare LLC, a market leader in critical cleaning, coating and lubricating products, has announced the appointment of John Stardellis as the company’s new Chief...
Murray Percival Co. Summer Cleaning Sale!
The Murray Percival Company, the leading supplier to the Midwest's electronics industry, is pleased to announce their Summer Cleaning Sale on select MicroCare and...
Electrolube Launch A New Generation of Conformal Coatings & Thermal Gap Fillers at Productronica
To increase electronics reliability in the harshest of environments, the global electro-chemicals manufacturer, Electrolube, will launch its most exciting conformal coating and thermal management...
KYZEN to Discuss New Aqueous Cleaning Solution for No-Clean Flux Residues at the SMTA...
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Rocky Mountain Expo & Tech Forum, scheduled to take...
SMTconnect 2022 – heartbeats of electronic production quicken
SMTconnect, which will take place from 10-12 May in Nuremberg offers a highly relevant program for visitors to the exhibition. With important exhibitors in...
High Thermal Impact Reliability BGA Sphere from SHENMAO
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile...
Indium Corporation Expert to Present on Innovative Liquid Metal Thermal Management Technology at ThermalLIVE™
Indium Corporation's Miloš Lazić, product development specialist, will share his industry insight on the next generation of metal thermal interface materials (TIMs) during ThermalLive™,...
Ventec Expands World Class Hydrocarbon PCB Laminate Range with New Material for High-end RF...
Ventec International Group Co., Ltd. has expanded its tec-speed 20.0 range of hydrocarbon-based PCB materials with the new tec-speed 20.0 VTM1000i hydrocarbon laminate. Offering...
