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SHENMAO Offers Lead-Free Solder Paste PF606-P for Advanced “Reverse Hybrid” Assembly Process
SHENMAO America, Inc. is proud to announce the availability of its lead-free solder paste PF606-P for use in the cutting-edge "Reverse Hybrid" board assembly...
KYZEN to Feature MICRONOX Semiconductor Grade Cleaning Chemistries at CHIPcon 2025
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the CHIPLET and Heterogeneous Integration Packaging Conference and Exhibition, or CHIPcon,...
NanoFlowX Appoints MaRC Technologies as its Newest Representative
NanoFlowX, the leader in ultra-thin protective coatings for electronics, has appointed MaRC Technologies to represent its product line in the Pacific Northwest region of...
Element Solutions Inc Completes Acquisition of Micromax® Business
Element Solutions Inc (ESI) today announced the completion of its acquisition of the Micromax conductive pastes and inks business, effective February 2, 2026. Micromax...
Ventec Strengthens Canada OEM Activities with Appointment of Sigma Component Design
Ventec International Group Co., Ltd. (6672 TT) today announced the appointment of Sigma Component Design (Sigma) to provide sales and support to OEM customers...
MacDermid Alpha Launches ALPHA CVP-390V High Reliability Solder Paste for Harsh Operating Conditions
MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of ALPHA CVP-390V high reliability solder paste, designed to...
Heraeus Electronics joins PowerAmerica Institute
Heraeus Electronics, a global leader in packaging materials for the Power Electronics industry, joins PowerAmerica Institute to advance the use of wide bandgap (WBG)...
KYZEN Celebrates Long-Time Participation and Support for the Surface Mount Technology Association
The SMTA organization has been a great global networking tool for many years. Many organizations benefit from the numerous events and educational opportunities and...
Indium Corporation to Present on e-Mobility at SMTA Dallas
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric...
Emil Otto Expands Range with Non-labelled Soldering System Cleaner
With Etimol SEM 12 RAA, Emil Otto GmbH is launching a non-labelled medium for cleaning reflow ovens, wave and selective soldering systems and vapour...
