Indium Corporation® received a Circuits Assembly New Product Introduction (NPI) Award for Indium12.9HF, a halogen-free solder paste engineered for cost-effective, low-silver alloys, including SAC105...
KOKI Europe, a global leader in advanced soldering materials, is highlighting the capabilities of its S3X58-HF1200 lead-free solder paste, a high-performance SMT material engineered...
As a proven leader in soldering materials and metal thermal interface materials (TIMs) solutions for future-forward technologies, Indium Corporation® will showcase its AI-enabling product...
Indium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance, while addressing power...
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at APEC 2026, March 22-26,...
AdvancedPCB today announced the promotion of John Stine to Chief Technology Officer (CTO). A widely respected figure in the PCB industry, Stine has nearly...
SolderKing Assembly Materials has launched SAC0307, a new low-silver addition to its SK P2-5 solder paste range. The new product enables manufacturers to review...
Dymax,a global manufacturer of light-curing materials and equipment, will exhibit at APEX EXPO 2026, held March 17–19, 2026, at the Anaheim Convention Center in...