AIM Solder is pleased to announce its participation in the upcoming SMTA Ohio Valley Expo and Tech Forum. This event takes place August 20 at Embassy Suites by Hilton Cleveland-Rockside in Independence, Ohio. As a leading global manufacturer of solder assembly materials for the electronics industry, AIM will be showcasing cutting-edge soldering materials. These include the innovative REL61 alloy.
AIM designed REL61 as a drop-in replacement for SAC305. By reducing silver content and incorporating a small percentage of bismuth, REL61 delivers performance equal to or better than SAC305 across all metrics at a much lower price point. With silver prices reaching record highs, there’s never been a better time to switch. Mid- to large-scale manufacturers have already saved hundreds of thousands of dollars annually by converting to REL61. In production for over a decade, a broad range of electronics manufacturers have adopted REL61. This product is available in bar, solid and cored wire, and solder paste for use across all assembly applications.
