Trymax Secures Multi-Million-Dollar Supply Agreement with AOI to Support InP Laser Manufacturing

Trymax Secures Multi-Million-Dollar Supply Agreement with AOI to Support InP Laser Manufacturing

Trymax Semiconductor Equipment (“Trymax”), a specialist manufacturer of plasma- and UV-based solutions for the semiconductor and optoelectronics industries, today announced that it has been...
Seika Machinery’s Sixth SMI 2026 Webinar Series Focuses on SAWA SMT One-Stop Solution for Stencil Management

Seika Machinery’s Sixth SMI 2026 Webinar Series Focuses on SAWA SMT One-Stop Solution for...

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will present the sixth session of its SMI 2026 Summer Webinar...
KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit in Booth I2423 at SEMICON Taiwan from September 2-4, 2026, at TaiNEX...
Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026,...
Nordson Electronics Solutions introduces the new ASYMTEK Vantage® XL precision fluid dispensing system for panel-level packaging (PLP) during semiconductor manufacturing at SEMICON Taiwan 2026.

Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL fluid dispensing system for panel-level...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address...
WEISUN - FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

WEISUN – FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

Taiwanese thermal processing equipment maker WEISUN Industrial Co., Ltd. has added a dedicated 310 x 310mm configuration to its AQWOL-5S Smart Clean Room and...
Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1

Two Teams Tie for Top Honors in Bright Electronics Manufacturing Challenge 2026 Round 1

The Electronics Manufacturing & Assembly Collaborative (EMAC) today announced the Round 1 results of the Bright Electronics Manufacturing Challenge 2026, and for the first...
BTU International Introduces Aurora Vacuum™ Reflow Oven for High-Volume, High-Yield Electronics Manufacturing

BTU International Introduces Aurora Vacuum™ Reflow Oven for High-Volume, High-Yield Electronics Manufacturing

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced the launch of the Aurora Vacuum™...
TRI at the IPC CFX Smart Factory Demo Line at FBC ASEAN 2026

TRI at the IPC CFX Smart Factory Demo Line at FBC ASEAN 2026

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will participate as a key technology partner in...
Indium Corporation to Showcase High-Reliability Power Device Packaging Solutions at PCIM Asia 2026

Indium Corporation to Showcase High-Reliability Power Device Packaging Solutions at PCIM Asia 2026

As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products that are “Electrifying the Future”...