The Global Electronics Association today announced Yossi Sheffi, Ph.D., best-selling author, entrepreneur and Massachusetts Institute of Technology (MIT) professor, will deliver the opening keynote address at APEX EXPO 2027 on Tuesday, April 6, focused on the forces reshaping the global electronics industry.
Dr. Sheffi’s keynote, “The Future of Electronics: Navigating AI, Geopolitics and Global Disruption,” will examine how AI and high-performance computing demand, semiconductor and advanced-packaging capacity, geopolitical pressures, regional manufacturing, resilient sourcing, automation and workforce transformation are changing electronics supply chains and manufacturing strategy.
“APEX EXPO brings together the people building the future of electronics,” said Matt Kelly, chief technology officer and vice president of technology solutions, Global Electronics Association. “Dr. Sheffi’s perspective on supply chain resilience, AI and global disruption will give attendees timely insight into how electronics leaders can prepare for what comes next.”
About Dr. Sheffi
Dr. Sheffi is the Elisha Gray II Professor of Engineering Systems at MIT, Director of the MIT Center for Transportation & Logistics, and Founder of the MIT SCALE Network. A globally recognized expert in supply chain management, systems optimization and risk analysis, he has advised governments and global enterprises on resilience, innovation and the future of work.
Dr. Sheffi is a successful entrepreneur who has founded or co-founded five technology and logistics companies, including Logistics.com and Syncra Systems. He is also the author of nine award-winning books, including The Magic Conveyor Belt: Supply Chains, A.I., and the Future of Work, which explores the impact of technology on supply chains and the global workforce.
“Few industries sit more directly at the intersection of AI, manufacturing, geopolitics and supply chain risk than electronics,” said Dr. Sheffi. “I look forward to joining APEX EXPO 2027 to discuss how leaders can build resilience, adapt to disruption and position their organizations for the next wave of global technology growth.”
APEX EXPO 2027 will bring together the global electronics manufacturing supply chain for technical education, professional development, standards development, networking and an exhibition featuring the latest technologies, materials, equipment and processes. The event will include the Advanced Electronic Packaging Conference (AEPC), professional development courses, standards committee meetings and networking opportunities for OEMs, EMS providers, PCB manufacturers, designers, suppliers and other industry leaders.
APEX EXPO will take place April 3-8, 2027, at the Anaheim Convention Center. www.apexexpo.org
