Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will discuss formic acid soldering and its rise as a cutting-edge alternative for traditional flux within the electronics assembly space at PCB West, September 29-October 2, in Santa Clara, California.
The presentation, Advanced Reflow Technology: Formic Acid Soldering, will explore the fundamentals of formic acid reaction chemistry and its use in modern soldering processes. The session will demonstrate where, how, and at what scale formic acid is used, as well as key process parameters that influence solder joint formation. The presentation will also examine the advantages and limitations of formic acid reflow compared with traditional methods. Formic acid reflow with the addition of vacuum can enable a true no-clean process, achieve ultra-low voiding, and reduce environmental impact by eliminating the cleaning step and associated waste.
Ryan Mayberry leads the application development team for the Indium Corporation ESM product line. He collaborates across internal functions to develop process recommendations and support new product qualifications, primarily in the growing power electronics and thermal management market segments.
PCB West visitors can attend Mayberry’s presentation on September 30, 3:30 PDT. To learn more about Indium Corporation’s Formic Acid Soldering Technologies (FAST), visit indium.com or meet with our experts at PCB West booth 612.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Mexico, Singapore, South Korea, the United Kingdom, and the U.S.
