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IPC Issues Call for Participation for IPC APEX EXPO 2025
IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2025. The technical conference will...
Bill Capen to Present at STAR-Light Virtual Event on July 8, Hosted by Heartland...
The Heartland SMTA Chapter has announced a follow-up to the successful STAR (Strategic Technology Advancement Research) event held in April. This new event, dubbed...
Cleaning and Activating Surfaces with Openair-Plasma for High-performance Electronic Products
Safe and effective cleaning of components and reduction of oxide layers, e.g. in semiconductor production or IGBT power modules, is essential for the electronics...
KYZEN to Focus on AQUANOX A4618 and ANALYST2 at SMTA Oregon
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo & Tech Forum, scheduled to take place...
Tresky Allows Dispensing of Over 100 mm² for Large Area Sintering Applications
The integration of large-area power modules with an area of over 100 mm² is highly relevant. These modules are of great importance for various...
KYZEN to Highlight 3D Printing Process Resin Cleaners at RAPID + TCT
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at RAPID + TCT 2024, scheduled to take place June 25-27, 2024,...
StenTech BluPrint™ PVD Surface Treatment showcased at SMTA Querétaro Expo & Tech Forum
StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is excited to announce its participation at the SMTA Querétaro Expo & Tech...
Experiencing Cutting-Edge Inspection Solutions at PCIM Europe 2024 with Viscom
Viscom AG is excited to announce its participation in PCIM Europe 2024, the leading international exhibition and conference for power electronics, intelligent motion, renewable...
Indium Corporation to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the...
Essemtec is Exhibiting at SMTconnect Booth 4.209
We invite you to SMTconnect, Booth 4.209, from June 11 - 13 in Nuremberg, Germany. Discover Essemtec's solutions with all-in-one combined dispensing & pick-and-place...
