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IPC’s Highest Honor, the Raymond E. Pritchard Hall of Fame Award Presented to Industry...

In recognition of their extraordinary contributions to IPC and the electronics manufacturing industry, Garry McGuire, NASA and Teresa Rowe, IPC, were both inducted into...
ITW EAE Wins New Product Introduction Award for Camalot Tilt and Rotate Dispenser Technology

ITW EAE Wins New Product Introduction Award for Camalot Tilt and Rotate Dispenser Technology

ITW EAE is proud to announce that it has earned a 2023 New Product Introduction (NPI) Award for Camalot’s Tilt and Rotate dispensing technology....
Elan Industries Selects Hentec Industries/RPS Automation as Selective Soldering Supplier of Choice

Elan Industries Selects Hentec Industries/RPS Automation as Selective Soldering Supplier of Choice

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Elan Industries has finalized...
INDUSTRY TRENDS DRIVING INNOVATION AT CELANESE MICROMAX™ CONDUCTIVE INKS

Industry Trends Driving Innovation at Celanese Micromax™ Conductive Inks

Celanese Corporation Micromax™ Conductive Inks today announced the launch of nine new product grades for the printed electronics market at the IPC APEX EXPO....
Saki Receives NPI Award 2023 for Innovative 3D-AOI 3Di Series Solution

Saki Receives NPI Award 2023 for Innovative 3D-AOI 3Di Series Solution

Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has been awarded a New Product Introduction (NPI) Award 2023...
Koh Young Honored with Multiple Product Awards at IPC APEX EXPO

Koh Young Honored with Multiple Product Awards at IPC APEX EXPO

Koh Young Technology, the industry-leader in True 3D measurement-based inspection solutions, is proud to announce the industry recognized two of its new electronics inspection...
Automating wedge bonding for complex wire components

Automating Wedge Bonding for Complex Wire Components

RF and mmWave specialist, Filtronic has further enhanced its hybrid and semiconductor packaging capabilities by investing in a fully automated wedge bonder suitable for...
SMT Tooling to Demo Matrix Tooling on a Hanwha / ESE Screen Printer at APEX

In-line Ultrasonics Monitoring with Innovative APM Solution from Ecoclean

In high-purity industries, companies are increasingly faced with the challenge of recording and documenting all cleaning process parameters for each batch of parts. Until...
SMT Tooling to Demo Matrix Tooling on a Hanwha / ESE Screen Printer at APEX

SMT Tooling to Demo Matrix Tooling on a Hanwha / ESE Screen Printer at...

SMT Tooling, a division of PSA Systems, today announced that it will showcase its Matrix™ Automatic SMT Support Tooling system on a Hanwha/ESE printer...
Heraeus Electronics to Provide Latest Materials Portfolio at NEPCON Japan 2023

Heraeus Electronics Provides Latest Materials Portfolio for Next-generation Power Electronics and Semiconductor Advanced Packaging...

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023,...