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Indium Corporation Introduces Indalloy®291 Supplemental Bar Alloys
Indium Corporation announces that it is now offering supplemental bar alloys for Indalloy®291 wave solder pots designed to maintain recommended solder pot specifications.
The supplemental...
The Global Electronics Association Launches Design Village at APEX EXPO 2026
APEX EXPO, the hallmark electronics tradeshow hosted by the Global Electronics Association, announced today the launch of the Design Village, a new feature in...
CyberOptics Unveils New Dual-mode MRS™ Sensor for Solder Paste Inspection at IPC APEX 2022
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new Dual-Mode MRS sensor for...
The Test Connection Partners with Capitol Technology University to Support NASA RockSat ODIN Payload
Capitol Technology University continues to advance its RockSat sounding rocket payload, Observation & Detection Interpreted by Neural-networks (ODIN), following its selection by NASA for...
Rehm Thermal Systems Launching New Distribution in Switzerland
Rehm Thermal Systems GmbH starting the new year with a new sales partner. As of January 1, 2022, Hilpert electronics AG will take over...
A.R.T. to Address ‘Right First Time’ Manufacturing at Southern Manufacturing & Electronics 2026
Advanced Rework Technology Ltd. (A.R.T.) will present an informative seminar on the importance of design for manufacture at Southern Manufacturing & Electronics 2026, alongside...
Indium Corporation Introduces Liquid Flip-Chip Flux
Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.
WS-3910 is a water-soluble,...
Embedded Vision Measurement Technology and Boundary Scan Solutions at Embedded World
From March 10-12, 2026, the embedded world Exhibition & Conference, the annual industry gathering for the embedded community, will take place in Nuremberg. As...
Indium Corporation to Present at SMTA Boise
Indium Corporation’s Claire Hotvedt, CSMTPE, product development specialist, will present on low-temperature solders for printed circuit board (PCB) assembly at the SMTA Boise Expo...
Siemens Acquires Canopus AI to Bring AI-based Metrology to Semiconductor Manufacturing
Siemens today announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of...
