ECD Strengthens Engineering Team with New Software Development Hire

ECD Strengthens Engineering Team with New Software Development Hire

ECD announced today that it has hired software engineer Nickolas (Nick) Short to support the company’s product growth and innovation efforts.  In his role,...
Siemens and Arizona State University Launch PCB Design Microcredential to Address Critical Hardware Design Skills Gap

Siemens and Arizona State University Launch PCB Design Microcredential to Address Critical Hardware Design...

Siemens, in collaboration with Arizona State University (ASU) has today announced a new online microcredential program in printed circuit board (PCB) design - ‘PCB...
ESSEGI Automation Showcases Open Integration at EFX 2026

ESSEGI Automation Showcases Open Integration at EFX 2026

ESSEGI AUTOMATION will exhibit at the first edition of EFX 2026, taking place in Stuttgart from October 6 to 8, where visitors can meet...
KIC to Showcase Automatic Profiling at SMTA Chihuahua Expo & Tech Forum 2026

KIC to Showcase Automatic Profiling at SMTA Chihuahua Expo & Tech Forum 2026

KIC announces that it will exhibit at the SMTA Chihuahua Expo & Tech Forum on Thursday, August 20, 2026, at the Hotel Sheraton Soberano...
Koh Young Brings smart AI solutions to Consecutive SMTA Regional Events Across North America

Koh Young Brings smart AI solutions to Consecutive SMTA Regional Events Across North America

Koh Young Technology, the global leader in True3D measurement-based inspection and smart AI solutions, will strengthen its engagement with electronics manufacturers across North America...
DISTRON Brings High-Reliability Medical Manufacturing Expertise to MEDevice Boston

DISTRON Brings High-Reliability Medical Manufacturing Expertise to MEDevice Boston

DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, will be exhibiting at MEDevice Boston 2026, taking place August 26–27 at the Thomas M. Menino...
Siemens Advances Self-verifying Agentic AI Workflows for Semiconductor and PCB Design

Siemens Advances Self-verifying Agentic AI Workflows for Semiconductor and PCB Design

Siemens today announced an expansion of its strategic partnership with NVIDIA to deliver self-verifying agentic AI workflows to EDA, helping semiconductor and printed circuit...
ESCATEC Expands Smart Manufacturing Capabilities with New Automated Line in Penang

ESCATEC Expands Smart Manufacturing Capabilities with New Automated Line in Penang

Global EMS provider ESCATEC has further strengthened its smart manufacturing capabilities with the installation of a highly automated assembly line at ESCATEC Electronics (EEM)...
PLUS Insights at EFX (6 – 8 October 2026, Stuttgart): The expert forum from trade journal PLUS will be taking place on the EFX Stage. | Copyright: Franziska Kraufmann / Messe Stuttgart

PLUS Insights at EFX: Lecture Programme Now Finalised

“PLUS Insights”, the expert forum for electronics manufacturing at the Expo for Electronics Manufacturing (EFX), taking place in Stuttgart from 6 to 8 October...
IBL Löttechnik Presents Intelligent Process Control for Vapour Phase Soldering Technology at EFX 2026

IBL Löttechnik Presents Intelligent Process Control for Vapour Phase Soldering Technology at EFX 2026

IBL Löttechnik GmbH’s Advanced Process Control (APC) and Automatic Gradient Control ensure greater process reliability, reproducible soldering profiles, and reduced setup time for vapour...