CE3S Welcomes John Romanowicz as Strategic Sales Development Manager

CE3S Welcomes John Romanowicz as Strategic Sales Development Manager

Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, has appointed John Romanowicz as Strategic Sales Development Manager. In...
Seika Machinery’s Sixth SMI 2026 Webinar Series Focuses on SAWA SMT One-Stop Solution for Stencil Management

Seika Machinery’s Sixth SMI 2026 Webinar Series Focuses on SAWA SMT One-Stop Solution for...

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will present the sixth session of its SMI 2026 Summer Webinar...
Microscreen Opens New Stencil Manufacturing Facility in Oxford, Connecticut

Microscreen Opens New Stencil Manufacturing Facility in Oxford, Connecticut

Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, is pleased to announce the opening of its newest facility...
Alternative Component Network Expands with Seven New Manufacturing Partners

Alternative Component Network Expands with Seven New Manufacturing Partners

Alternative electronic component distributor, Zel Components, has expanded its partner network with seven new manufacturers, providing engineers and procurement teams greater access to certified,...
Selective PCB potting using the dam-and-fill process protects defined areas of highly integrated automotive PCBs

PCB Potting for Battery Management Systems: How Polyurethanes Ensure Reliable Automotive Electronics

In the highly complex multilayer printed circuit boards (PCBs) used in modern battery management systems, selective potting plays a crucial role in reducing the...
KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit in Booth I2423 at SEMICON Taiwan from September 2-4, 2026, at TaiNEX...
Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026,...
Plasmatreat Sets Course for Future Requirements: New Leadership Team Expands Technology Portfolio

Plasmatreat Sets Course for Future Requirements: New Leadership Team Expands Technology Portfolio

With an expanded technology portfolio, Lukas and Magnus Buske and their teams are positioning Plasmatreat to meet future demands in industrial surface treatment. AURORA-Plasma...
Nordson Electronics Solutions introduces the new ASYMTEK Vantage® XL precision fluid dispensing system for panel-level packaging (PLP) during semiconductor manufacturing at SEMICON Taiwan 2026.

Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL fluid dispensing system for panel-level...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address...
WEISUN - FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

WEISUN – FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

Taiwanese thermal processing equipment maker WEISUN Industrial Co., Ltd. has added a dedicated 310 x 310mm configuration to its AQWOL-5S Smart Clean Room and...