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Indium Corporation Expert to Host SiP Printing Webinar
Indium Corporation’s Evan Griffith, product specialist for Semiconductor and Advanced Assembly Materials, will host two webinar sessions about the fundamentals of System-in-Package (SiP) printing...
Hentec Industries/RPS Publishes Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published techniques for selective soldering...
Electrolube’s UR5118 resin Ticks All The Boxes for IoT RF Sensor Application
As the world witnesses the rapid rise of the IoT revolution, sensor usage is being leveraged to a whole new level. Electrolube, the global manufacturer of electro-chemicals, has...
Murray Percival Co. Summer Cleaning Sale!
The Murray Percival Company, the leading supplier to the Midwest's electronics industry, is pleased to announce their Summer Cleaning Sale on select MicroCare and...
NEOTech Westborough, MA Receives “Outstanding Achievement in Stormwater Management & Water Quality Award”
NEOTech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, is proud...
Elements of Indium by Indium Corporation: Cold Welding
The term “welding” often conjures up an image of an arc welder’s helmet and sparks dancing across the metal’s surface. Although heat is often...
Mycronic receives order for two SLX systems
Mycronic AB (publ) has received an order for two SLX systems from a new customer in Asia. The order value is in the range...
Naprotek Appoints New SVP of Business Development
Naprotek, LLC, the leading provider of high-reliability, quick-turn prototypes, and low-to-medium volumes PCBAs and box builds, today announced the appointment of Jim Apfel as...
Z-AXIS Expands PCB Assembly Capacity with Selective Solder Equipment
Latest investment enhances NY-based contract manufacturer’s capabilities and quality for mixed-technology printed circuit board assembly.
Z-AXIS, Inc. (www.zaxis.net) has added an Ersa VersaFlow 3/45 selective...
Indium Corporation Introduces New Adhesive Solution
Indium Corporation has released NC-702, a no-clean, near-zero residue, halogen-free adhesive solution designed for holding parts in place during placement and reflow processes.
Designed for...
