The die-to-die bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW).
Ultrasonic welding can reduce bonding pressure and temperature. This...
Horizon Sales is pleased to introduce the new Mobile Sonic Stencil Cleaning System. The Mobile Sonic provides tabletop storage for stencil cleaning supplies and...
ITW EAE is releasing a proprietary syringe cooling option that increases the “pot-life” of underfill materials by maintaining the syringe at controlled temperature within...
The U.S. Partnership for Assured Electronics (USPAE) is entering a new phase of rapid growth to better connect the electronics industry with government needs...
High Precision 3D-CT AXI New Model 3Xi-M200 V2 - featuring improved inspection ability, higher speed, and low maintenance.
Saki Corporation, an innovator in the field...
Vector 300 offers unmatched thermal capability, rapid programming, and simplistic elegance in operation.
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and...
Surface-mount assembly processes can generate large quantities of data that hold the secrets to continuous improvement. Unlocking those secrets is the challenge for the...
StenTech Inc., the leading provider of stencils to the electronics manufacturing industry in North America, is pleased to announce the appointment of Greg Starrett...
Essemtec presents the unique All-In-One platform for dispensing and pick-an-place for the electronics manufacturing at SMTAI, MN Booth 1137, November 2nd – 3rd November....
MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, will exhibit its latest interconnect solutions and present five papers at the...