Seica booth at Electronica 2026 showcasing OPERA platform, Pilot VX ULTRA, S20 IS³, and VALID SL systems

Seica at Electronica 2026: 40 Years of Innovation Shaping the Future of Electronic Test

With 40 years of innovation behind it, Seica continues to advance electronic test through new technologies and integrated solutions. At Electronica 2026, the company...
Quasys Europe expands semiconductor portfolio with Grintimate wafer grinding and Longhill wafer handling equipment for European market

Quasys Europe takes over European distribution for Grintimate and Longhill

Quasys Europe is acquiring the European distribution rights for Grintimate and Longhill products. As a result, Quasys Europe will consolidate European distribution of various...
Mark Isola, newly appointed Director of Supply Chain at XLR8 EMS, San Diego

XLR8 EMS Appoints Mark Isola as Supply Chain Director to Strengthen Operational Efficiency and...

XLR8 EMS, a leader in fast, reliable and high-quality PCBA manufacturing solutions, is pleased to announce the appointment of Mark Isola as Director of...
William Ong, newly appointed Global Head of Business Line Semiconductor Materials at Heraeus Electronics

William Ong to Lead Business Line Semiconductor Materials at Heraeus Electronics

Heraeus Electronics is pleased to announce that effective November 1, 2026, William Ong has been appointed Global Head of Business Line Semiconductor Materials. With...
Arch Systems receiving the 2026 Mexico Technology Award for AI-Powered Quality Defect Investigation Agent at SMTA Guadalajara

Arch Systems Wins 2026 Mexico Technology Award for AI-Powered Quality Defect Investigation Agent

Arch Systems, a leader in manufacturing data and AI solutions, has been honored with a 2026 Mexico Technology Award in the AI Technology category...
Microscreen MicroGlide Platinum heat-fused nanocoated SMT solder stencil winning 2026 Global Technology Award

Microscreen’s Advanced Heat-Fused Nanocoating Wins 2026 Global Technology Award

Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, has received a 2026 Global Technology Award in the Stencils...
Tresky T-200 Lab Bonder and Active Alignment system for advanced packaging and photonics at SEMICON Europa 2026

Tresky showcases advanced packaging and photonics solutions at SEMICON Europa 2026

Tresky GmbH will present solutions for demanding packaging and bonding processes in the semiconductor industry at SEMICON Europe 2026, taking place November 10–13 in...
Rehm Thermal Systems Vision RCC reflow soldering system combining convection, condensation and vacuum technology

Rehm Thermal Systems Introduces Vision RCC: Three Technologies Combined in an Innovative Reflow Soldering...

New soldering system combines convection, condensation and vacuum technology for reliable processing of complex SMD assemblies weighing up to 25 kg Rehm Thermal Systems has...
Indium Corporation assistant product manager presenting on compressible metal thermal interface materials at TestConX China 2026

Indium Corporation Expert to Explore Factors Driving Performance of Compressible Metal TIMs at TestConX...

Indium Corporation® Assistant Product Manager Foo Siang Hooi will discuss the critical factors that influence the performance of compressible metal thermal interface materials (TIMs)...
Bold Laser Automation LPC1010CO2 laser precision cutting and drilling platform for PCB and electronic materials

New CO2 Laser Cutting and Drilling Platform Enhances PCB and Electronic Materials Manufacturing

Bold Laser Automation has introduced the LPC1010CO2 Laser Precision Cutting and Drilling Platform, a high-performance manufacturing system designed for precision drilling, skiving, cutting, trimming,...