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ByteSnap Design Unveils New Insights on MISRA C Compliance in Real-world Applications
ByteSnap Design, one of the UK’s leading embedded software and electronic design companies, has released a practical guide to MISRA C compliance, drawing on...
Green Circuits Joins Edge Autonomy Partner Day for Inside Look at Next-Generation Uncrewed Systems
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, recently attended the Edge Autonomy Partner Day held in San Luis Obispo,...
Heller Industries Becomes the Latest Partner to Join THE SMT FUTURE EXPERIENCE
Heller Industries becomes the latest partner to join THE SMT FUTURE EXPERIENCE, bringing reflow oven expertise to complete the technology chain for the venue's...
Expanded kolb Portfolio: New Chamber Size for Greater Flexibility
The new 6 series from kolb Cleaning Technology offers greater capacity with a small footprint.
With the addition of the PSE LH6 and the AQUBE®...
KYZEN’s Beth Bivins Honored as MetalForming Magazine’s 2025 Woman of Excellence
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce that Beth Bivins, who serves as Global Product Manager –...
The Global Electronics Association Launches Design Village at APEX EXPO 2026
APEX EXPO, the hallmark electronics tradeshow hosted by the Global Electronics Association, announced today the launch of the Design Village, a new feature in...
MaRCTex, Inc. Expands Regional Presence with Addition of Outside Sales Representative for North Texas...
MaRCTex, Inc., a leading provider of equipment, services, and solutions for the electronics manufacturing industry, is pleased to announce the addition of Ryan Gunderson...
Indium Corporation Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE...
Indium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International...
SHENMAO Technology, Inc. Launches SMF-TA52, a Zero-Residue Transient Adhesive Designed for Formic Acid Reflow
SHENMAO Technology, Inc. has introduced its new SMF-TA52 transient adhesive, a material created specifically for the growing use of formic acid reflow soldering in...
Koh Young Recognized with Productronica Innovation Award for its AI-powered Process Optimization Solution
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, has been recognized with a Productronica Innovation Award for its breakthrough KPO...
