IPC logo

IPC Delivered a Letter to Congress Signed by 49 Industry Executives

This week, IPC delivered a letter to Congress signed by 49 industry executives, representing most of the U.S. electronics supply chain, urging Congress to...
IPC logo

Electronics Industry Sentiment Rose in April, Hitting New High

According to IPC’s April Sentiment of the Global Electronics Manufacturing Supply Chain, April 2024 marked the third consecutive month of sentiment growth among electronics...
What’s Next Becomes Now at IPC APEX EXPO 2024

What’s Next Becomes Now at IPC APEX EXPO 2024

From revolutionary advancements in artificial intelligence, augmented reality and the latest innovations in capital equipment on the show floor to a heightened learner experience...
IPC logo

IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards

IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at...
IPC logo

North American PCB Industry Sales Down 11.6 Percent in February

IPC announced today the February 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.07. Total North...
IPC logo

North American EMS Industry Up 4.1 Percent in February

IPC announced today the February 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.22. Total North American...
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly...
IPC logo

Foreign Object Debris for Electronics Manufacturing Course Available in Spanish, French and German

IPC has announced the expansion of its complimentary training offerings for IPC members with the introduction of a “Foreign Object Debris (FOD) for Electronics...

GEN3 to Demo SIR Testing, Stencil Cleaning & More with Horizon Sales at APEX

Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, to announce its participation in the 2024 IPC APEX EXPO, scheduled...

AIM Solder Recognized for 25 Years of IPC Membership

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its receipt of recognition for 25...