DIE Bonding prototyping and the production of small series

Tresky offers DIE bonding prototyping and small series production

In the prototyping phase and when producing small series or batch size 1, many companies shy away from investing in their own Die-Bonder. Often,...
macdermid alpha logo

MacDermid Alpha to Present High Performance Solder Alloys for Automotive Applications at HiTEN 2022

MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present its High Performance Solder Alloys...

Umicore Coatings Services appoints Naples as new Managing Director

Umicore Coating Services, a leading manufacturer and supplier of infrared precision optical filters and coatings, has announced Mark Naples as its new Managing Director. Naples,...
whma ipc

WHMA/IPC Offer Wire Harness Operator Training at M-EXPO

The Wiring Harness Manufacturer’s Association (WHMA)/IPC will offer a three-day, in-person Wire Harness Assembly for Operators (WHO) training course at M-EXPO Wire Processing Technology...
Bondtec

Top-quality Wire Bonding Connections Guaranteed Thanks to QuattroClean Snow-jet Cleaning

Ultrasonic wire bonding has been established as a contacting method in the microelectronics and semiconductor industry for many years. The technology is also ideally...
kodiak assy

Kodiak Assembly Solutions Helps Customer Build Award-Winning Tech

Kodiak Assembly Solutions LP, a leading contract electronic manufacturer, announces that its longtime customer, NXP Semiconductors, was awarded “Best in Show” at Embedded World...
GEN3 CHRIS HUNT

Gen3’s Dr Chris Hunt, CTO Submits an Insightful Paper to the Journal of Surface...

Gen3 a British manufacturer of testing and measuring the electronics industry announced that Dr Chris Hunt, CTO, has written a paper for SMTA on...
inovaxe inauto

New LIVE Webinar: All About InoAuto

Inovaxe, a world leader and provider of innovative material handling and inventory control systems, is pleased to announce its new LIVE WEBINAR: All About...
hentec topline

Topline Electronics Purchases Hentec/RPS Odyssey 1750 Component Lead Tinning System

Hentec Industries/RPS Automation is pleased to announce that Topline Electronics has finalized the purchase of a Hentec/RPS Odyssey 1750 robotic hot solder dip component...
Stan Farnsworth

Stan Farnsworth, OE-A Chairperson to Present during Sensors Converge Conference

PulseForge, Inc., a new spinoff of NovaCentrix, is pleased to announce that Stan Farnsworth, OE-A Chairperson and Chief Marketing Officer at PulseForge, will present...