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IPC Rolls out Red Carpet for Standards A-Team Volunteers at Annual Golden Globe Awards...

The third annual Golden Gnome Awards ceremony was held on May 16, 2023, at IPC SummerCom. The awards recognize the outstanding and creative work...
Yi Zhou SMTA

2021 Charles Hutchins Educational Grant Winner Announced

SMTA is honored to announce Yi Zhou, a graduate student at the Georgia Institute of Technology, has been selected as the winner of the...
EVS and The Murray Percival Co. to Showcase the EVS 500LF at SMTA Ohio Valley

EVS and The Murray Percival Co. to Showcase the EVS 500LF at SMTA Ohio...

EVS International, the leader in solder recovery, today announced plans to exhibit at the SMTA Ohio Valley Expo & Tech Forum, scheduled to take...
TechBlick's popular FREE TO ATTEND Online Innovations Day is back!

TechBlick’s popular FREE TO ATTEND Online Innovations Day is back!

Have you registered yet?  On 4 April TechBlick will hold its FREE-TO-ATTEND online Innovations Day, focusing on additive, sustainable, flexible, hybrid, wearable and 3D electronics.  It will also feature a parallel track dedicated...
Yamaha Robotics Delivers Complete Surface-mount Line to Astemo UK

Yamaha Robotics Delivers Complete Surface-mount Line to Astemo UK

Yamaha Robotics has supplied its 1 STOP SMART SOLUTION for surface-mount assembly to Astemo UK, Ltd. The company, based in Bolton, is the UK...
hentec rps pulsar

Semtech Purchases Hentec/RPS Pulsar Solderability Test System

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Semtech Corporation has purchased...
Discover Omron Roadshow: Unlocking Success for UK Manufacturers Amid Industry Challenges

Discover Omron Roadshow: Unlocking Success for UK Manufacturers Amid Industry Challenges

The UK manufacturing industry is currently navigating a landscape riddled with formidable challenges, including surging raw material costs, a labour shortage, high energy prices,...

ITW EAE Granted Patent No. 10,780,516 for Electrovert® DwellFlex™ 4.0 Variable Contact Wave Solder...

The U.S. Patent and Trademark Office has issued Patent No. 10,780,516 protecting Electrovert’s DwellFlex 4.0 Variable Contact Wave Solder Nozzle. Invented by ITW EAE...
Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH

Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH

Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J. Wagner as its new General Manager. With a career spanning over...
CE3S Introduces the DXB-880 Wafer Bonder for High-Precision, Void-Free Bonding

CE3S Introduces the DXB-880 Wafer Bonder for High-Precision, Void-Free Bonding

Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to introduce the DXB-880 Wafer Bonder, an advanced...