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Intertek Hires Business Development Manager
Intertek Laboratories, Inc., a design, manufacturing, engineering, and testing company, is pleased to announce the hiring of Michael R. Rosen as Business Development Manager....
Top Investment Certification on 2nd Anniversary Boosts ESCATEC’s European Presence
Two significant milestones in recent days by ESCATEC’s business unit in Bulgaria adds much momentum to the EMS provider’s strategy to nearshore cost-effective and...
PCB WEST 2025 Reports 4% Attendance Growth
Attendance at the PCB West 2025 conference and exhibition held in the Silicon Valley this month grew 3.5% year-over-year, the Printed Circuit Engineering Association...
ASC International Celebrates 30 Years as a Global Supplier of 3D AOI-SPI Solutions
ASC International, a leading manufacturer of 3D solder paste inspection (SPI) and automated optical inspection (AOI) systems, is pleased to announce its 30-year anniversary....
Indium Corporation to Host Free Webinar on Lead-Free Solder Paste for Automotive Applications
Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications. The webinar, part...
Cybord Announces New OEM Partnership with Siemens Digital Industries Software
Cybord, an inline visual AI electronic component analytics software leader that implements AI & Big Data technology, today announced it has signed a new...
KYZEN Cleaning Experts to Spotlight MICRONOX Line at SMTA Wafer-Level Packaging Symposium
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Wafer-Level Packaging Symposium scheduled to take place February 17-19...
CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging...
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous...
Registration Open for the 2023 WHMA 30th Annual Wire Harness Conference
Registration is now open for the 2023 WHMA 30th Annual Wire Harness Conference, the industry’s only annual global leadership conference for the wire harness...
Heraeus Electronics to Present During the E-Mobility Forum at PCIM Europe
Heraeus Electronics today announced that Susanne Klaudia Duch, Project Leader Development - Copper Sinter Paste, and Dennis Ang, Global Product Manager - Die Attach...
