Heraeus Electronics, MacDermid Alpha Electronics Solutions and Henkel Win Patent Infringement Lawsuit Against Senju...

Heraeus, Alpha Assembly Solutions and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe...
IPC logo

IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

IPC has released IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards. This document is the base standard for addendums covering military and space...

New, Automated, In-line Dimensional Measurement Systems from the NEXIV Series Range

Two new models have been added to Nikon Metrology's latest NEXIV S-range of CNC video measuring systems, which are suitable for in-line, automated dimensional...
Pushing Limits: Indium Corporation to Present on Metal TIMs Solutions for Demanding Thermal Environments at CSPT

Pushing Limits: Indium Corporation to Present on Metal TIMs Solutions for Demanding Thermal Environments...

Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of next-generation...
Variscite

Variscite Releases New System on Module for Energy-Efficient Machine Learning Edge Devices

Variscite, a leading worldwide System on Module (SoM) designer, developer and manufacturer, today announced new, state-of-the-art SoM for energy-efficient machine learning edge devices. Variscite’s...
Redefining Solder Paste Application – Essemtec Reaches 1.1 Million Dots per Hour

Redefining Solder Paste Application – Essemtec Reaches 1.1 Million Dots per Hour

Essemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly High Speed solder paste jetting technology,...
Women’s Leadership Program to Host Speed Mentoring during SMTA International 2022

Women’s Leadership Program to Host Speed Mentoring During SMTA International 2022

The Women’s Leadership Program (WLP), an SMTA-sponsored organization that strives to promote diversity and inclusion in engineering and manufacturing fields, announces that it will...
Perfect connection

Perfect Connection

The die-to-die bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW). Ultrasonic welding can reduce bonding pressure and temperature. This...
Ecoshrink 1

New EcoShrink™ Compostable Film Bids to Keep Plastics Out of Landfills!

In today’s world, many are looking for “greener” ways to approach packaging. This includes looking at the entire range of the product’s life cycle—from...
PVA Jaime Erickson

PVA Announces New Operations Department and Director of Operations

PVA, a global supplier of automated dispensing and coating equipment, today announced the addition of an Operations Department tasked with bridging multiple departments to...