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ACM Research Announces Major Upgrades to Its Ultra C wb Wet Bench Cleaning Tool...
ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced major...
Ventec Consolidates and Upgrades European Production and Logistics Center in Germany
Ventec International Group has begun consolidating operations and installing new, state-of-the-art facilities at its European production and logistics hub in Kirchheimbolanden, Germany.
Following the PCB...
Hirose Launches World’s Smallest Width Multi-RF Board-to-Board Connector
Hirose has released a multi-RF board-to-board connector that provides a size reduction of up to 71% compared to conventional designs. With the industry’s smallest...
IPC Education Foundation (IPCEF) Named Scholarship Provider for Opportunity Next Colorado
The IPC Education Foundation (IPCEF) promotes opportunities for students to access information and financial assistance for careers in the electronics manufacturing industry. In addition...
Award-Winning Murray Percival Company Expands Product Offering with Depanelizers
The Murray Percival Company announces the addition of Murray Percival Depanelizers to its extensive product lineup. These high-quality depanelizers are now available in stock...
DSL Expands Inspection Capabilities with Acquisition of MIRTEC MV-3 OMNI from Bentec Ltd
Datasound Laboratories Ltd. (DSL), a leading provider of industrial computing solutions and electronic design services, is proud to announce the acquisition of the MIRTEC...
Naprotek Appoints New CFO Mike Lee
Naprotek, LLC, a leading provider of high-reliability, quick-turn electronics manufacturing, is pleased to announce the appointment of Mike Lee as the Chief Financial Officer. ...
Seika Offers McDry Cabinets with Data Loggers
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to offer McDry cabinets with Data Loggers as an...
Yamaha Robotics Introduces Surface-mounter Innovations for Easy-fit Performance Boost
Yamaha Robotics SMT Section has introduced three hardware-based performance options for high-speed mounters that enhance productivity, quality control, and flexibility for handling special products...
Enabling Technology will Transform PCB Assemblies
The Occam Group’s (TOG) game-changing solderless assembly technology will reorder the way electronic components are assembled, greatly improving reliability and performance, while significantly reducing...
