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Green Circuits Adds Double-Sided Flying Probe
Green Circuits, Inc., a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the addition of a Takaya Double-Sided Flying...
New One-Day Surface Metrology and Tribology Class, November 14, 2024
Registration is open for the new one-day Surface Metrology and Tribology class, which will be held in Livonia, Michigan, Nov. 14, 2024. The one-day...
Cogiscan Collaborates with Koh Young to Unveil how its Factory Insights Software Transforms Data...
Koh Young, the industry leader in True3D measurement-based inspection solutions, is excited to announce Factory Insights, the latest offering from Cogiscan, will be demonstrated...
Incap Slovakia Integrates ERP and MES Systems to Accelerate Operations
Incap Slovakia, part of the global EMS provider Incap Corporation, has implemented SAP Business One (SAP B1) to strengthen operational control, improve traceability, and...
Thermal Shock Temperature Lifetime Modeling of Large Area Sintered Silver Baseplate Modules
Abstract—This study investigates the potential of novel large-area sintered silver pastes for establishing highly reliable interconnections between baseplates and metallic ceramic substrates such as...
Cogiscan joins iTAC for Productronica 2021 to demonstrate collaborative SMT Factory Digitalization solutions
Cogiscan, the leading connectivity and TTC solutions provider for the electronics manufacturing industry, is proud to join iTAC Software AG for Productronica 2021 in...
Ventec to Launch New Bondply Dielectrics and Value-Added Services at IPC APEX 2024
Ventec International Group is to reveal new products for advanced signal integrity and thermal performance, and introduce services, during IPC APEX Expo 2024, April...
Foxconn Guadalajara Implements Hentec/RPS Selective Soldering Equipment
Hentec Industries/RPS Automation is pleased to announce that Foxconn Guadalajara has implemented a Hentec/RPS Vector 460 selective soldering system. The Vector 460 is lead-free...
Heraeus Electronics Showcases New Portfolio for Next-generation Semiconductor Advanced Packaging and Power Electronics at...
Heraeus Electronics is excited to announce its participation in the SEMICON Taiwan exhibition. The event is scheduled to take place Sept. 6-8, 2023 at...
X-FAB and Fraunhofer ENAS Sign Strategic Cooperation Agreement to Accelerate Microtechnology Innovations
The Fraunhofer Institute for Electronic Nano Systems ENAS and X-FAB are joining forces in an innovative cooperation model: the “Lab-in-Fab” approach that integrates research,...
