MIRTEC Celebrates the Receipt of Its 10th Service Excellence Award!

MIRTEC, the ‘Global Leader in Inspection Technology’, proudly announces its receipt of the prestigious 2023 Service Excellence Award from CIRCUITS ASSEMBLY magazine in the...
Bentec Appoints New Sales Engineer

Bentec Appoints New Sales Engineer

Bentec are pleased to announce that Gareth O’Flattery has joined their team as a Technical Sales Engineer. Gareth is a highly qualified engineer with...
Circuit Technology Training Inc. Launches New “Introduction to X-ray Inspection” Training Course

Circuit Technology Training Inc. Launches New “Introduction to X-ray Inspection” Training Course

Circuit Technology Training Inc. (CTTI), a leading IPC training group, is excited to announce the launch of its new Introduction to X-ray Inspection course....

Horizon Sales Welcomes Andre Kundert as New Sales Representative for Florida Territory

Horizon Sales is pleased to announce the newest addition to its team, Mr. Andre Kundert. Joining the company in November 2023, Andre brings with...
Management Change at Mycronic

Management Change at Mycronic

Mycronic AB (publ) has appointed Annika Haaker as Senior Vice President People & Culture and member of Mycronic’s Executive Management team, with commencement at...
Inovaxe Welcomes Daniel Enríquez Gómez as Regional Sales Manager for Northern Mexico

Inovaxe Welcomes Daniel Enríquez Gómez as Regional Sales Manager for Northern Mexico

Inovaxe, a world leader and provider of innovative material handling and inventory control systems, is pleased to announce the appointment of Daniel Enríquez Gómez...

LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry

The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this...
Indium Corporation to Introduce New Heat-Spring® HSx Metal Thermal Interface Material for Semiconductor Test at TestConX

Indium Corporation to Introduce New Heat-Spring® HSx Metal Thermal Interface Material for Semiconductor Test...

Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be...

PEMTRON to Showcase Dual Lane Inspection System at SMTA Tijuana

PEMTRON, an inspection equipment developer and supplier, is pleased to announce that it will be exhibiting its innovative D2 (Dual Lane & Dual Head)...
Essemtec Tackles Printed Electronics Process Challenges with Smart Jetting and Placement at TechBlick Boston

Essemtec Tackles Printed Electronics Process Challenges with Smart Jetting and Placement at TechBlick Boston

Essemtec, a global leader in adaptive, highly flexible surface mount technology (SMT) solutions, is pleased to announce its participation at TechBlick’s Electronics Reshaped USA...