The SMTA is excited to announce the technical program for the Wafer-Level Packaging Symposium. The symposium will be held February 13-15, 2024 at The...
IPC announced today the November 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00.
Total North...
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced that it was awarded two 2021...
Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project...
Ventec International Group Co., Ltd. (TWSE:6672.TT) announces that Thailand has been selected as the location for its new state-of-the-art PCB materials manufacturing facility. The...
The Murray Percival Company, the premier manufacturer’s rep in the Midwest and one of the longest tenured distributors in the electronics industry, is pleased...
The 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off today...
Specialty Coating Systems (SCS) is pleased to announce its upcoming webinar, Navigating Conformal Coating Choices to Meet Performance and Reliability Requirements, scheduled for Wednesday,...