Sleek, Durable, and Sustainable – The Possibilities of In Mold Electronics (IME)

Functionality is at the heart of in-mold electronics - a technology concerned with creating seamlessly integrated electronic functions into hardware, particularly within automotive interiors....
Laser Technologie Modernizes Its Machine Fleet with CIF and DCT

Laser Technologie Modernizes Its Machine Fleet with CIF and DCT

Laser Technologie, a French specialist in stencil manufacturing for the electronics industry for over 20 years, has chosen to integrate a new DCT M3...
SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents...
Hernon 321-Potting-Penny

Hernon Manufacturing Introduces Tuffbond® 321 for Casting, Potting and Encapsulating Components

Hernon Manufacturing, Inc.®, a leading producer of high-performance adhesives, sealants, UV LED curing lights and precision dispensing systems, is pleased to introduce Tuffbond® 321....

First UK Showing of New Europlacer Screen Printer at Southern Manufacturing.

Europlacer will show its newly-launched ii-P7 surface mount screen printer at the Southern Manufacturing event in Farnborough next month. It will be the first...

Driving E-Mobility with Copper Sinter Innovations: Heraeus Electronics Partner of Public Funded Joint Project...

Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project...

StenTech’s Photo Stencil Specialized Products Division Facility Update Completed!

StenTech® Inc., a leading global company specializing in SMT Printing Solutions, has completed a major technology update to their Photo Stencil Specialized Products Division...

IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers

A new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to...
The Critical Path to Building Resilience in Electronics Manufacturing: Flexible Supply Chains and the New Role of Component Distribution

The Critical Path to Building Resilience in Electronics Manufacturing: Flexible Supply Chains and the...

In recent years, the electronics manufacturing industry is undergoing profound changes. The global supply chain has been continuously reconfigured driven by geopolitics, epidemic aftermath...
ITW EAE patented Auto Exit Wing Feature for Electrovert® Wave Soldering Machines

ITW EAE patented Auto Exit Wing Feature for Electrovert® Wave Soldering Machines

ITW EAE’s patented feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity....