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Cetec ERP Announces Dates for Erpalooza 2025: A Live Training and Networking Experience for...
Cetec ERP is excited to announce the return of its flagship event, Erpalooza 2025, a two-day live training and networking conference tailored for manufacturers,...
ROCKA Solutions to Showcase Comprehensive Manufacturing Solutions at the Del Mar Show
ROCKA Solutions is excited to announce its participation in the upcoming Del Mar Electronics & Manufacturing Show, scheduled to take place on April 24-25,...
Nordson TEST & INSPECTION Showcases State-of-the-art Inspection and Metrology Solutions at SEMICON Taiwan
Nordson TEST & INSPECTION today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The company will...
New MOTIX™ Family of Full-bridge ICs for Smart Brushed DC Motor Applications Enables Comfort...
With the automotive industry continuing to evolve, features that were once considered premium are now becoming standard. As a result, smart low-voltage motors will...
New AOI Software Version with Enhanced 3D Capabilities – GOEPEL electronic
Users of AOI and SPI systems from GOEPEL electronic can look forward to a software update. With the rollout, the system software PILOT AOI...
When the Chips are Down
Jerry Beeney, Director Of Global Business Development For Science & Automation At Teledyne FLIR
The demand for microchips globally is surging. In fact, it’s expected...
South-Tek Systems Appoints Jens Bolleyer as CEO
South-Tek Systems announces Jens Bolleyer was appointed as the company’s CEO effective August 30, 2021. An experienced business leader, Mr. Bolleyer steps into the...
IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
IPC has released IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards. This document is the base standard for addendums covering military and space...
Indium Corporation Senior Research Chemist to Present at CSTIC
Indium Corporation senior research chemist Mary Ma is set to deliver a technical presentation titled Printable Copper Sintering Paste for High-Power Die-Attach Applications at...
TRI to showcase AI-powered Inspection Solutions at NEPCON China 2021
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join NEPCON China held at Shanghai World...
