Heraeus, Alpha Assembly Solutions and Henkel have won in the patent infringement lawsuit against Senju Group (Senju Metal Industry Co., Ltd., Senju Metal Europe...
IPC has released IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards. This document is the base standard for addendums covering military and space...
Two new models have been added to Nikon Metrology's latest NEXIV S-range of CNC video measuring systems, which are suitable for in-line, automated dimensional...
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of next-generation...
Variscite, a leading worldwide System on Module (SoM) designer, developer and manufacturer, today announced new, state-of-the-art SoM for energy-efficient machine learning edge devices. Variscite’s...
Essemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly High Speed solder paste jetting technology,...
The Women’s Leadership Program (WLP), an SMTA-sponsored organization that strives to promote diversity and inclusion in engineering and manufacturing fields, announces that it will...
The die-to-die bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW).
Ultrasonic welding can reduce bonding pressure and temperature. This...
In today’s world, many are looking for “greener” ways to approach packaging. This includes looking at the entire range of the product’s life cycle—from...
PVA, a global supplier of automated dispensing and coating equipment, today announced the addition of an Operations Department tasked with bridging multiple departments to...