goepel electronics

New system for 3D selective solder joint inspection

With a new GOEPEL electronic integration solution, optical inspection of selective solder joints in 3D is now also possible. The AOI module "Selective Line...
Incap Celebrates 40 Years with a Focus on Future Talent and Community Impact

Incap Celebrates 40 Years with a Focus on Future Talent and Community Impact

Incap Corporation, a global Electronics Manufacturing Services (EMS) provider and one of the top EMS companies in Europe, celebrates its 40th anniversary in 2025...
TRI and Bosch Partner on AI Solution for MEMS Packaging

TRI and Bosch Partner on AI Solution for MEMS Packaging

Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership...
Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium in Niskayuna, NY

Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging...

Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship and participation in the...
SMTA

SMTA Seeks Applications for 2023 Stromberg Scholarship

The SMTA is excited to announce they are currently accepting student applications for the JoAnn Stromberg Student Leader Scholarship by April 28, 2023. The $3,000...

Know-how Transfer at Rehm – Digital and In-Person

Webinars, hybrid trade shows, digital meetings: Events in the workplace are increasingly shifting to the internet. The challenges of the Corona crisis have further...
Triplett Announces EPC600 Environmental Particle Counter for Indoor Air Quality Monitoring

Triplett Announces EPC600 Environmental Particle Counter for Indoor Air Quality Monitoring

Triplett Test Equipment, a leading maker of test equipment tools, announces the Triplett Model EPC600 Environmental Particle Counter, a compact and portal tool ideal...
PCEA

EIPC and PCEA Announce Upcoming ‘Design to Fabrication’ Technical Symposium

The EIPC, (European Institute for the PCB Community) and Printed Circuit Engineering Association (PCEA) will cohost a "Design to Fabrication" Technical Symposium this spring...
incap logo

The Board of Directors of Incap Corporation Decided on a New Performance Period Within...

The Board of Directors of Incap Corporation decided 27th April 2022 to establish a new share-based incentive plan for the group's key employees. The...

Driving E-Mobility with Copper Sinter Innovations: Heraeus Electronics Partner of Public Funded Joint Project...

Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project...