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Bentec Appoints New Sales Engineer
Bentec are pleased to announce that Gareth O’Flattery has joined their team as a Technical Sales Engineer. Gareth is a highly qualified engineer with...
Gen3 to Exhibit at the 24th European Microelectronics & Packaging Conference
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimization equipment, is excited to announce its participation at the 24th European Microelectronics...
AIM Appoints Diego Jiang as Product Manager
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Diego Jiang as...
SMTXTRA Welcomes E-Tronix as Representative for Crucial Territories
SMTXTRA, a renowned leader in Surface Mount Technology (SMT) equipment services, is proud to announce the appointment of E-Tronix, a Stromberg Company, as its...
Juki America Announces New Regional Sales Manager for the Southwest Territory
Juki America – EAS Division, a global leader in automated assembly products and systems, proudly announces the appointment of Sean McMillen as the new...
TIC Expansion Modules for the SCANFLEX II Controller Family in a Double Pack
GOEPEL electronic is expanding its portfolio of Test Access Port (TAP) Interface Cards (TIC) with two new modules. The plug-in variant SFX II TIC01/VX...
MacDermid Alpha Electronics Solutions Expands Singapore Production Facility to Meet Growing Global Demand for...
MacDermid Alpha Electronics Solutions, a global leader in specialty chemicals and materials for electronics manufacturing, announces the expansion of its production facility at 14...
