The Training Connection Welcomes Industry Veteran Jack Harris to Lead Training Partnerships

The Training Connection Welcomes Industry Veteran Jack Harris to Lead Training Partnerships

The Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the...
Data I/O Unveils Next-Generation LumenX Programming Platform at productronica 2025

Data I/O Unveils Next-Generation LumenX Programming Platform at productronica 2025

Data I/O Corporation (NASDAQ: DAIO), the leading global provider of data programming and security provisioning solutions for microcontrollers, security ICs and memory devices, announced...
Siemens acquires ASTER Technologies to deliver industry-leading PCB test engineering solutions

Siemens acquires ASTER Technologies to deliver industry-leading PCB test engineering solutions

Siemens today announced it has acquired ASTER Technologies (“ASTER”), a privately held market leader in printed circuit board assembly (PCBA) test verification and engineering...
Austin American Technology Strengthens Operations with Strategic Team Expansion

Austin American Technology Strengthens Operations with Strategic Team Expansion

Austin American Technology (AAT) is continuing to expand its team as the company grows its manufacturing capabilities and prepares to support increasing demand for...
cts to Exhibit at EFX Alongside Partner AdoptSMT

cts to Exhibit at EFX Alongside Partner AdoptSMT

cts is strengthening its collaboration with partner AdoptSMT at EFX 2026 in Stuttgart: following their joint exhibition appearance at productronica 2025, manufacturing automation expert...
NEPCON ASIA 2026 – Where Global Electronics Manufacturers Source Next Gen Production Solutions

NEPCON ASIA 2026 – Where Global Electronics Manufacturers Source Next Gen Production Solutions

Driven by booming AI‑led innovation, advanced packaging evolution and global supply‑chain realignment, the electronics manufacturing industry is undergoing profound transformation, with Asia accounting for...
Adaptsys Re-flex inline carrier tape forming system and 3DInspect automated inspection system on display at SMTAI 2026

Adaptsys Heads to SMTAI with Inline Taping and Inspection on Display

The Adaptsys Group will exhibit at SMTA International 2026, taking place October 27–29 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees...
MIT Professor Yossi Sheffi speaking at a global electronics industry conference on AI and supply chain resilience

MIT’s Yossi Sheffi to Headline Global Electronics Association APEX EXPO 2027

The Global Electronics Association today announced Yossi Sheffi, Ph.D., best-selling author, entrepreneur and Massachusetts Institute of Technology (MIT) professor, will deliver the opening keynote...
AIM Solder and X5 Company partnership announcement for solder materials distribution in Brazil

AIM Solder Signs New Distributor X5 Company in Brazil

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the signing of X5 Company as...
Mycronic

High Volume division makes acquisition in China

Mycronic’s Assembly Solutions High Volume division has signed an agreement to acquire Shenzhen Huan Cheng Xin Precision Manufacture Co., Ltd., a company with around...