Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimization equipment, is excited to announce its participation at the 24th European Microelectronics & Packaging Conference (EMPC) taking place Sept. 11-14, 2023 at the Wellcome Genome Campus, Hinxton, near Cambridge, UK.

At the conference, Sascha Lohse, from Finetech, Gen3’s principal will be presenting a paper titled ‘Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding.’ The presentation will delve into the challenges faced in producing large format, high-density IR thermal imaging FPA devices, Quantum processors, and micro LED displays using fine pitch micro Indium bump array interconnections that meet the rigorous industry requirements of today.

Lohse is an esteemed expert in microsystems technology, having graduated in the field in 2006 from the University of Applied Science in Berlin. He has acquired extensive experience in both frontend and backend processes while working at the Hahn Schickard Gesellschaft and the Fraunhofer IZM. Presently, Sascha leads the product management, application, and technical documentation teams, and he serves on Finetech’s executive board. His profound knowledge of multiple bonding technologies has allowed him to tackle various packaging challenges throughout his career.

The EMPC conference provides an ideal platform for Gen3 to showcase its advanced microelectronics solutions to a diverse audience of industry professionals, researchers, and decision-makers. Gen3’s cutting-edge technology addresses the industry’s evolving needs, enabling customers to achieve exceptional results in their microelectronics projects.

Gen3 looks forward to engaging with conference attendees, networking with industry peers, and demonstrating its commitment to advancing microelectronics technologies.

For further information about Gen3 and their range of reliable test and measurement equipment, please visit

About GEN3
GEN3, Testing and measuring the electronics industry for over 50 years.  For three generations, Gen3 have designed, engineered, manufactured, and distributed their test and measurement equipment into the electronics industry to shield their clients from failure in the field.
Their reputation for excellence has grown to a global scale. The team is made up of industry experts who work to set the standards around circuit testing, measurement, and compliance.  They collaborate with key industry associations, offering our unique experience and expertise to educate all on what it takes to succeed.  For product protection the preferred way is Gen3, where precision comes as standard, acting as a mentor and your front-line defender.
In the high-reliability arena, there is too much at stake to allow room for error. Testing must be finite and flawless. Gen3 understand the need for precision. Get closer to perfection by minimising your risk.

GEN3. Precision as Standard.

For more information, please visit our various platforms;

Twitter: @Gen3Systems