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Martin Heinz is the New CEO of iTAC Software AG
MES/MOM provider iTAC Software AG has a new CEO: Martin Heinz will take over the position of Chief Executive Officer (CEO) with effect from...
Ventec International and Giga Solutions Forge One-Stop-Shop Cooperative Agreement for PCB Production
Ventec International Group Co., Ltd. (6672 TT), has announced a cooperative agreement with UK-based Giga Solutions Ltd. By leveraging Ventec’s purchasing, finance and sales...
NürnbergMesse Italia Launches “Focus on Components” B2B Event for Electronic Components in Vicenza
Focus on Components will debut alongside Focus on PCB, the printed circuit board show covering PCB, PCBA and EMS, on 21 and 22 April...
Made Smarter Awards Recognise Electronics Manufacturers Pursuing Digital Transformation
Three electronics businesses are among the first recipients of the Made Smarter Awards, which celebrate excellence in manufacturing.
The scheme has been launched to mark...
Yamaha Reveals Software Innovations to Boost Printing, Mounting, and Intelligent Factory
Yamaha Robotics Europe SMT Section has added new features to native equipment software and Intelligent Factory™ tools that accelerate equipment programming, increase production efficiency,...
Data I/O Announces Partnership with Nuvoton Technology Corporation Japan
Data I/O Corporation, the leading global provider of advanced security and data deployment solutions for microcontrollers, security ICs and memory devices, and Nuvoton Technology...
Join Bulgin at electronica 2024
Bulgin – a leading manufacturer of environmentally sealed connectors and components – will be showcasing its broad range of connectors and switches on stand...
TekPulse Launches BOM Risk Intelligence Platform for European Electronics and EMS Teams
TekPulse has launched a browser-based BOM Risk Intelligence platform that helps procurement managers, EMS providers, and hardware engineering teams find supply-chain, compliance, and tariff...
Henkel Highlights End-use Printed Electronics Innovations for Smart Surfaces, Smart Healthcare, and Smart Connectivity
During the upcoming LOPEC trade show from February 26 and 27 in Munich, Germany, Henkel will showcase innovations for end-use printed electronics applications across...
Cortec® Presents Latest Packaging Innovation: CorShield® Resealable Bubble Bags Powered by Nano-VpCI®!
CorShield® Resealable Bubble Bags and Static Shielding Bubble Bags combine volatile corrosion inhibitors with cushioning packing bubbles to provide protection for sensitive or delicate...
