Hands-on technology and an individual lecture programme with test and inspection solutions at the ETFN

Hands-on Technology and an Individual Lecture Programme with Test and Inspection Solutions at the...

How are the increasing challenges of electronics manufacturing being tackled? The 8th ETFN Electronics Technology Forum North in Hamburg will provide answers to these...
Thermal Shock Temperature Lifetime Modeling of Large Area Sintered Silver Baseplate Modules

Thermal Shock Temperature Lifetime Modeling of Large Area Sintered Silver Baseplate Modules

Abstract—This study investigates the potential of novel large-area sintered silver pastes for establishing highly reliable interconnections between baseplates and metallic ceramic substrates such as...

PVA to Show State-of-the-Art Conformal Coating Solutions at SMTconnect 2024

PVA, a global supplier of automated dispensing and coating equipment, is excited to announce its participation in the upcoming SMTconnect exhibition, scheduled to take...
Perfect connection

Perfect Connection

The die-to-die bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW). Ultrasonic welding can reduce bonding pressure and temperature. This...
CONFIDEE- Guiding You Through Tariff Uncertainty

CONFIDEE – Guiding You Through Tariff Uncertainty

The current tariff landscape presents significant challenges for businesses, with shifting trade policies and increased duties impacting supply chains and overall costs. Navigating these...
PCEA

EIPC and PCEA Announce Upcoming ‘Design to Fabrication’ Technical Symposium

The EIPC, (European Institute for the PCB Community) and Printed Circuit Engineering Association (PCEA) will cohost a "Design to Fabrication" Technical Symposium this spring...

Heraeus Electronics Hosts ALL2GaN Event Showcasing Advances in High-Efficiency Power Electronics

Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau. This...

Mek Unveils ROI Calculator to Help Electronics Manufacturers Assess AOI Investment

Mek (Marantz  Electronics), a leading provider of Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) systems, is proud to launch its new Return...
25 Years ProtoLaser: From Vision to Precision Revolution in Electronics Manufacturing

25 Years ProtoLaser: From Vision to Precision Revolution in Electronics Manufacturing

What began in 1989 as a research project between LPKF Laser & Electronics SE and the University of Hannover has developed into one of...
ASMPT presents optimized Odd Shaped Component (OSC) Package

ASMPT Presents Optimized Odd Shaped Component (OSC) Package

With the optimized SIPLACE OSC Package, technology and market leader ASMPT SMT Solutions is strengthening the competitiveness of modern electronics manufacturing. The enhanced package...