ASMPT Semiconductor Solutions at ECOC 2025

ASMPT Semiconductor Solutions at ECOC 2025

ASMPT will be present when the ECOC 2025 Exhibition, Europe’s leading trade fair for optical communication, opens its doors in Copenhagen from September 29...
Setting Sail for New Horizons at This Year’s Viscom Technology Forum

Setting Sail for New Horizons at This Year’s Viscom Technology Forum

Viscom AG’s Technology Forum has a reputation for offering participants wide-ranging content with valuable practical relevance in a compact format. Looking at the big...

New Adhesive for Automotive Lighting

DELO has developed a new adhesive for automotive lighting applications. DELO PHOTOBOND OB4189 is resistant to yellowing and, with its high aspect ratio, is...
PCEA

EIPC and PCEA Announce Upcoming ‘Design to Fabrication’ Technical Symposium

The EIPC, (European Institute for the PCB Community) and Printed Circuit Engineering Association (PCEA) will cohost a "Design to Fabrication" Technical Symposium this spring...
Europlacer Puts Intelligent, Connected Production in the Spotlight at Southern Manufacturing

Europlacer Puts Intelligent, Connected Production in the Spotlight at Southern Manufacturing

Europlacer, a global leader in flexible SMT assembly solutions, will exhibit at Southern Manufacturing & Electronics 2026, taking place February 3–5 at the Farnborough...

Umicore Coatings Services appoints Naples as new Managing Director

Umicore Coating Services, a leading manufacturer and supplier of infrared precision optical filters and coatings, has announced Mark Naples as its new Managing Director. Naples,...
Mycronic

Management Change at Mycronic

As a result of the preparations ahead of a possible listing of Axxon on a stock exchange in China, effective March 19, 2024, Ivan...
Asscon

Asscon will present three new vapor phase soldering systems at productronica 2023

Asscon will present three new vapor phase soldering systems at productronica 2023 ASSCON Systemtechnik-Elektronik GmbH presents three new vapor phase soldering systems at this year's...

LPKF Builds Partner Network to Innovate Glass Substrate Production for Semiconductor Packaging

Using glass substrates for advanced packaging and heterogeneous integration represents a major shift in the current semiconductor market and one of the biggest challenges...

Ventec Consolidates and Upgrades European Production and Logistics Center in Germany

Ventec International Group has begun consolidating operations and installing new, state-of-the-art facilities at its European production and logistics hub in Kirchheimbolanden, Germany. Following the PCB...