eia

Exciting opportunities for members as the Engineering Industries Association joins the Manufacturing Technologies Association...

The Manufacturing Technologies Association (MTA) today announces that The Engineering Industries Association (EIA) has been brought on board as part of the MTA family...
Incap Corporation: Incap’s Margus Jakobson appointed member of Incap Group’s Management Team

Incap Corporation: Incap’s Margus Jakobson Appointed Member of Incap Group’s Management Team

Margus Jakobson (born 1979, Civ. Eng.), interim Managing Director of Incap Estonia, has been appointed member of Incap Group’s Management Team as well as...
Astute Group Is Ready for Embedded World 2025

Astute Group Is Ready for Embedded World 2025

Global electronics distributor and supply chain partner, Astute Group, will be exhibiting at Embedded World 2025, featuring advanced technologies from a select group of...

Incap Corporation: Incap Slovakia Invests in New Production Machinery to Enhance Production Capabilities

Incap Slovakia upgraded its second SMT production line, replacing it with advanced SMT machinery. The EUR 891,000 investment increases the factory’s SMT production capacity...
LPKF Logo

Surface-Mount Technology for Developers

With circuit board plotters and laser systems for research and development, LPKF offers a comprehensive range of equipment for manufacturing printed circuit board prototypes....
Cope Technology’s Electric with Reshoring Win

Cope Technology’s Electric with Reshoring Win

A leading manufacturer of PCB assemblies is enjoying the fruits of employee-ownership after it reshored a significant product range. Cope Technology, which employs 40 people...
acp_JetStation-HP_manuell_TA-Process_3rV

New CO2 snow-jet booths in cleanroom compatible design Effective CO2 snow-jet cleaning process for...

Whether in medical engineering, the semiconductor industry, in laboratory and development environments or in other areas - parts produced in small quantities often have...

LPKF Builds Partner Network to Innovate Glass Substrate Production for Semiconductor Packaging

Using glass substrates for advanced packaging and heterogeneous integration represents a major shift in the current semiconductor market and one of the biggest challenges...

Mycronic Introduces New Machine Models to its High-performance Pick-and-place Platform MYPro A40

Mycronic, the leading Sweden-based electronics assembly solutions provider, is introducing two new machine models MYPro A40SX and A40LX to its next-generation MYPro A40 pick-and-place...
SGS logo

Fully Embrace a Circular Economy with SGS’s Circularity Services

SGS blends its standout testing, inspection and certification (TIC) expertise with three decades of sustainability leadership to create Circularity services within its IMPACT NOW...