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The die-to-die bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW).
Ultrasonic welding can reduce bonding pressure and temperature. This...
Indium Corporation’s Sze Pei Lim to Present on Solder Joint Reliability at IMPACT Conference...
Indium Corporation Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will be part of a panel presentation at the International...
Triplett Announces EPC600 Environmental Particle Counter for Indoor Air Quality Monitoring
Triplett Test Equipment, a leading maker of test equipment tools, announces the Triplett Model EPC600 Environmental Particle Counter, a compact and portal tool ideal...
BTU Partners with iRaptor to Offer Advanced Profiling Technology
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced a new strategic partnership with iRaptor...
Indium Corporation, SAFI-Tech Announce New Supercooled BiSn Solder Paste
Indium Corporation®, a global electronics materials manufacturer and SAFI-Tech, an Iowa-based startup that is creating no-heat and low-heat solder and metallic joining products, have...
INVENTEC PERFORMANCE CHEMICALS USA takes legal measures to protect their AMTECH brand.
INVENTEC PERFORMANCE CHEMICALS USA, a global provider of soldering, cleaning & coating materials for electronic, semiconductor and industrial applications, has filed a lawsuit in...
MacDermid Alpha’s Solutions for Photovoltaic Applications to be Highlighted at Energy is Future Expo,...
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will have its range of assembly solutions...
Indium Corporation Adds Two Members to Engineered Solder Materials Team
Indium Corporation is pleased to announce two new additions to its Engineered Solder Materials (ESM) team—Igor Faleichik, senior product specialist and Jim McCoy, product...
MacDermid Alpha to Present Automotive Traction Module Attach by Silver Sintering at IEMT Conference...
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present the technical paper: “Automotive Traction...
Indium Corporation Introduces New Talent Acquisition Supervisor Nate Discavage
Indium Corporation is pleased to announce that Nate Discavage has joined the company as a talent acquisition supervisor.
In this role, Discavage is responsible...
