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Nordson Electronics Solutions Hires Parker Abdo as Key Account Sales Manager for the Southwestern...
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, is pleased to announce Mr. Parker Abdo has been hired as Key Account Sales...
MicroFab Acquired by Naprotek, a Portfolio Company of Edgewater Capital Partners
Naprotek, LLC., a leading provider of high-reliability, quick-turn electronics manufacturing, has completed the acquisition of MicroFab, Inc., a privately held company in Manchester, New...
MacDermid Alpha to Showcase Latest Circuit Board Assembly Innovations at Upcoming SMTA Expos
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will highlight its range of advanced solutions...
PARMI Partners with Mactech
PARMI, a global leader in the PCB inspection machine sector, has partnered with Mactech to support customers in Argentina. Mactech (formerly under the name...
Innovative Dispensing Options from PVA at the SMTA Ohio Valley Expo
PVA, a global supplier of automated dispensing and coating equipment, today announced plans to exhibit at the SMTA Ohio Valley Expo & Tech Forum,...
Indium Corporation’s Donna Vareha-Walsh Elected to American Tin Trade Association Board of Directors
Indium Corporation is pleased to announce that its Director of Global Supply Chain and International Trade Compliance, Donna Vareha-Walsh, has been elected to the...
CyberOptics Selected by EM Innovation Awards for New SQ3000™+ System Powered by MRS® Sensor...
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, received a 2022 EM Innovation Award in the...
SGS To Host Power Semiconductor Device Packaging Impurity Analysis Webinar
SGS, the world’s leading testing, inspection and certification company, is hosting a complimentary webinar, ‘Power Semiconductor Device Packaging Impurity Analysis’, on Wednesday July 26,...
High Thermal Impact Reliability BGA Sphere from SHENMAO
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile...
Top-quality Wire Bonding Connections Guaranteed Thanks to QuattroClean Snow-jet Cleaning
Ultrasonic wire bonding has been established as a contacting method in the microelectronics and semiconductor industry for many years. The technology is also ideally...
