Bassel Haddad Assumes Leadership of ASMPT as Group Chief Executive Officer

Bassel Haddad Assumes Leadership of ASMPT as Group Chief Executive Officer

ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, today announced that Bassel Haddad has...

PROMATION Highlights Top 10 Reasons Why Electronics Manufacturers Choose Its Smart Line Solutions

PROMATION USA, a leading designer and manufacturer of advanced automation solutions for the electronics and micro-electronics industries, highlights the key advantages driving increased adoption...
Jack McCarthy, new Technical Writer and Communications Specialist at MW Associates electronics marketing agency

MW Associates Strengthens Technical Content Team with Addition of Jack McCarthy

MW Associates, a global all-electronics marketing and electronics assembly consultancy agency, is pleased to announce that Jack McCarthy has joined the agency as its...
ASMPT SMT Solutions booth at EFX Expo 2026 showcasing SIPLACE V assembly platform and DEK TQ L stencil printer

ASMPT SMT Solutions at EFX Expo for Electronics Manufacturing

ASMPT SMT Solutions will exhibit at the first EFX Expo for Electronics Manufacturing in Stuttgart, Germany. From October 6 to 8, the global technology...
TopLine’s Martin Hart to Present CTE Mismatch Solutions at SMTAI 2026

TopLine’s Martin Hart to Present CTE Mismatch Solutions at SMTAI 2026

TopLine CEO Martin Hart will present a paper on the topic of  advancing the art and science of using copper core solder columns to...
Precision Micro sees semiconductor revenue surge as AI drives manufacturing demand

Precision Micro sees semiconductor revenue surge as AI drives manufacturing demand

~ Chemical etching specialist reports 43 per cent growth as semiconductor supply chains scale for AI and advanced computing ~ Chemical etching specialist, Precision Micro...
Technical Cleanliness as a Quality-Critical Process Parameter in Advanced Packaging

Technical Cleanliness as a Quality-Critical Process Parameter in Advanced Packaging

The pace of innovation in the semiconductor industry is increasingly driven by the back end today. Chiplet architectures, 2.5D and 3D packaging, High Bandwidth...
Siemens Advances Self-verifying Agentic AI Workflows for Semiconductor and PCB Design

Siemens Advances Self-verifying Agentic AI Workflows for Semiconductor and PCB Design

Siemens today announced an expansion of its strategic partnership with NVIDIA to deliver self-verifying agentic AI workflows to EDA, helping semiconductor and printed circuit...

Amtech Electrocircuits Launches First Article to Deliver Practical AI Insights for Hardtech Manufacturers

New publication helps engineering teams separate AI hype from technologies that accelerate product development and manufacturing TROY, MI ― July 2026 ― Amtech Electrocircuits, a...

POLYN Technology and ALTER TECHNOLOGY France Establish Joint Chip Validation Lab

POLYN Technology, a developer of application-specific neuromorphic analog signal-processing (NASP™) chips, today announced a partnership with ALTER TECHNOLOGY France to establish a joint chip-validation...