KIC announced that David Meza, Senior Service Engineer, will present a live educational webinar hosted by the SMTA Guadalajara Chapter titled “Thermocouples Attachment Methods for Reflow Oven Profiling” on Thursday, July 30, 2026, from 12:00 PM to 1:00 PM (Central Mexico Time). Presented in Spanish, the complimentary webinar will examine how proper thermocouple attachment techniques can significantly improve the accuracy and reliability of thermal reflow profiles.
Accurate thermal profiles begin with accurate temperature measurements, and one of the most important factors affecting profile quality is how thermocouples are attached to the printed circuit board. During the one-hour session, Meza will explain how proper attachment methods can improve profile reliability, helping manufacturers achieve greater process consistency while reducing defects, rework, and scrap.
Attendees will learn:
- Best practices for improving the accuracy and repeatability of thermal reflow profiles.
- How proper thermocouple attachment methods can reduce defects, rework, and scrap.
- Results from a comparative study evaluating thermocouple attachment methods on modern HDI circuit boards.
With more than eight years at KIC, Meza has worked closely with electronics manufacturers throughout the Americas to optimize SMT processes and improve thermal performance. His expertise includes reflow profiling, wave soldering, thermal process optimization, Industry 4.0 initiatives, and manufacturing performance analysis. He is also an SMTA Certified Engineer, helping manufacturers improve quality, productivity, and process control through data-driven thermal optimization.
“Reliable thermal profiles begin with reliable measurements,” said Meza. “Understanding how thermocouple attachment methods influence profile accuracy enables manufacturers to make better process decisions and produce more consistent, higher-quality assemblies.”
Electronics manufacturing professionals interested in improving thermal process accuracy and reliability are encouraged to attend this free educational session.
Webinar Information
Title: Thermocouples Attachment Methods for Reflow Oven Profiling
Presenter: David Meza, Senior Service Engineer, KIC
Host: SMTA Guadalajara Chapter
Date: Thursday, July 30, 2026
Time: 12:00 PM – 1:00 PM (Central Mexico Time)
Language: Spanish
Cost: Complimentary
Registration
Attendance is complimentary, but advance registration is required. For additional information and to register, visit:
https://smta.org/events/EventDetails.aspx?id=2072844&group=225200
Then click the Register button to reserve your place.
