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XJTAG Announces New Board Appointment
XJTAG® has announced a new appointment to its Board with Peter Fryers joining the Board of Directors as Chief Operating Officer.
Peter Fryers brings extensive...
StenTech BluPrint™ PVD Stencils Launched in the USA, Setting New Standards for SMT Production
StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is proud to announce the U.S. launch of its StenTech BluPrint™ PVD Stencils,...
Austin American Technology Reports Strong Growth in Mexico
Austin American Technology (AAT) is proud to announce its continued growth and success in Mexico. The company recently completed a key HydroJet installation in...
Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components...
GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2™ Test System
GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability...
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
IPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship...
Capacitive Bubble Sensors: Cost-Effective Air Bubble Detection
In many industrial applications, it is important to precisely monitor the constant flow of liquids. Undesired air bubbles in the liquid stream are problematic...
Yamaha Robotics Brings Inspection Innovations for Growing Markets to electronica 2024
Yamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024, demonstrating the latest AI skills and special features for applications including...
IPC Introduces First Standard for In-Mold Electronics
IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes,...
Emil Otto Expands Successful Product Range with Further Flux Variants
With versions A and B of the alcohol-based fluxes EO-B-008 and EO-B-013, the Hessian flux specialist enables even better harmonisation with the soldering process...
