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IPC Hand Soldering Competition Returns to United Kingdom
The 2022 edition of the regional Hand Soldering Competition will return to United Kingdom in conjunction with Southern Manufacturing & Electronics industrial show. Located...
IPC Announces New Board Members at IPC APEX EXPO 2022
At the 65th IPC Annual Meeting on January 25, held in conjunction with IPC APEX EXPO 2022, the IPC Board of Directors announced new...
Indium Corporation Expert to Present at Wafer-Level Packaging Symposium
Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr. Dongkai Shangguan, strategic advisor, at the Surface...
IPC’s Highest Honor, the Raymond E. Pritchard Hall of Fame Award, Presented to Joe...
In recognition and acknowledgment of his extraordinary contributions to IPC and the electronics industry, Joe O’Neil, OAA Ventures, was presented with the IPC Raymond...
APCT Inc. Earns IPC-1791, Qualified Manufacturers Listing (QML) as Trusted Electronics Fabricator
IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronics Fabricator Requirements Qualified Manufacturers Listing (QML) to APCT Inc.’s printed circuit board (PCB) manufacturing...
MacDermid Alpha Electronics Solutions to Present Five Papers at IPC APEX EXPO 2022
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design...
The First Ultra-Secure, IIoT-based Smart Factory Achieved by Lockheed Martin, with IPC-CFX and...
Aegis Software, a global provider of Manufacturing Operations Management Software (MOM/MES), announces that Lockheed Martin’s Lufkin facility, have connected key SMT machines of all...
Hentec/RPS to Exhibit Leading Edge Soldering Equipment at IPC APEX EXPO 2022
Hentec Industries/RPS Automation is pleased to announce it will exhibit its full range of leading-edge selective soldering systems, component lead tinning machines and solderability...
Koh Young highlighting its Award-winning True 3D Inspection Solutions at IPC APEX Expo on...
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions and the Premier sponsor of IPC APEX Expo, will deliver live demonstrations...
Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at...
