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AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Dallas Expo &...
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA...
Surfx Technologies Receives Global Technology Award for Plasma Systems
Surfx Technologies, LLC, the most trusted name in atmospheric plasma, received a 2022 Global Technology Award in the category of Plasma Systems for its...
IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington,...
Wafer-Level Packaging Symposium Program Announced
The SMTA is excited to announce the technical program for the Wafer-Level Packaging Symposium. The symposium will be held February 13-15, 2024 at The...
SMTconnect 2022 Comes to Successful Close as Electronics Manufacturing Community Reunites
At the SMTconnect, which took place from 10 to 12 May 2022 in Nuremberg, Germany, it became clear how much life and energy there...
High Performance Inspection Solutions at SMTAI 2024
Test Research, Inc. (TRI) is joining the upcoming SMTA International Exposition & Conference on October 22 – 24, 2024, at the Donald E. Stephens...
MacDermid Alpha Electronics Solutions to Present Latest Research and Exhibit at SMTA International 2022
MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, will exhibit its latest interconnect solutions and present five papers at the...
Marcy LaRont Named Executive Director of I-Connect007 Group
Marcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 magazine this past year, has...
High-Speed Line Inspection at the SMTA Guadalajara 2024
Test Research, Inc. (TRI) will join the SMTA Guadalajara Expo 2024 to showcase our award-winning Inspection solutions for the SMT industry. Visit booth #1018...
New Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in...
A new study about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic...
