Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr. Dongkai Shangguan, strategic advisor, at the Surface...
In recognition and acknowledgment of his extraordinary contributions to IPC and the electronics industry, Joe O’Neil, OAA Ventures, was presented with the IPC Raymond...
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design...
Aegis Software, a global provider of Manufacturing Operations Management Software (MOM/MES), announces that Lockheed Martin’s Lufkin facility, have connected key SMT machines of all...
Hentec Industries/RPS Automation is pleased to announce it will exhibit its full range of leading-edge selective soldering systems, component lead tinning machines and solderability...
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions and the Premier sponsor of IPC APEX Expo, will deliver live demonstrations...
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at...
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design...