HyRel Technologies Successfully Recertifies to AS9100 with No Non-conformances

HyRel Technologies, a global provider of quick turn semiconductor modification solutions, proudly announces its successful recertification to the AS9100 standard with no non-conformances. This...
The Assembly Show and SMTA International Announce Co-Location In October 2024 IN ROSEMONT, IL

The Assembly Show and SMTA International Announce Co-Location In October 2024 IN ROSEMONT, IL

The ASSEMBLY Show and the Surface Mount Technology Association (organizers of SMTA International) are pleased to announce their co-location at the Donald E. Stephens...
Ventec’s Value-Added Equipment Division Welcomes Marc Ladle as Project Manager

Ventec’s Value-Added Equipment Division Welcomes Marc Ladle as Project Manager

Ventec is pleased to announce the appointment of Marc Ladle to the position of Project Manager for Ventec Giga Solutions, its value-added PCB equipment...

Order for a Compact 21 Research Platform in France

RIBER, the global leader for Molecular Beam Epitaxy (MBE) equipment serving the semiconductor industry, is announcing the sale of a double Compact 21 research...
PEMTRON to Exhibit a Benchmark in AOI & SPI Technology at SMTA Chihuahua Expo

PEMTRON to Exhibit a Benchmark in AOI & SPI Technology at SMTA Chihuahua Expo

PEMTRON, an inspection equipment developer and supplier, is excited to announce its participation in the SMTA Chihuahua Expo & Tech Forum. The event is...

onsemi Selects the Czech Republic to Establish End-to-End Silicon Carbide Production for Advanced Power...

Electrification, renewables and artificial intelligence are global megatrends converging and driving unprecedented demands for advanced power semiconductors capable of optimizing energy conversion and management....
CISSOID ingenuity facilitates faster inverter development

CISSOID ingenuity facilitates faster inverter development

CISSOID, a leader in power semiconductor solutions, is introducing the compact EVK-PLA1060 series of On-Board Inverter Reference Designs. This exciting advance further reduces time-to-market...

LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry

The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this...
SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents...

Syensqo at Semicon China 2024 with a Complete Portfolio of Polymer Solutions Advancing Chip...

Syensqo, previously part of Solvay Group, will demonstrate its advanced materials and services across all process needs to the semiconductor manufacturing industry at Semicon...