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Sintering as a Key Technology for the Energy Transition and E-mobility
Assemblies with high-performance semiconductors are key components for the global energy transition and electromobility. For this reason, Tresky GmbH from Hennigsdorf near Berlin has...
Data I/O Announces New SentriX Security Provisioning Services in Japan Through Noa Leading Co.,...
Data I/O Corporation, the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices announces Noa Leading...
Order for a New MBE Production System in Asia
RIBER, a global market leader for molecular beam epitaxy (MBE) equipment serving the semiconductor industry, is announcing an order for a MBE 6000 production...
Indium Corporation Introduces New Product Manager
Indium Corporation is pleased to announce that Amanda Hartnett has joined the company as Product Manager for Engineered Solder Materials (ESM).
In this role,...
Optimally Adapted Solutions for Precision and High-purity Applications
Whether it's a millimetre-small fastener, complex precision optics or metre-sized
machinery parts, the cleanliness requirements for high-tech components are
becoming stricter and more demanding...
Highest Machine Precision Thanks to Mother Nature
Particularly when it comes to the highest precision requirements, machine builders from different industries like to rely on a material that is thousands of...
Westerwood Global Acquires NSTAR® Global Services
Westerwood Global (Westerwood), a leading provider of managed service solutions, and NSTAR® Global Services (NSTAR), a leader in asset relocation, facility and equipment services,...
Heraeus Electronics Showcases New Portfolio for Next-Generation Power Electronics and Semiconductor Advanced Packaging at...
For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At...
Automating Wedge Bonding for Complex Wire Components
RF and mmWave specialist, Filtronic has further enhanced its hybrid and semiconductor packaging capabilities by investing in a fully automated wedge bonder suitable for...
Heraeus Electronics Provides Latest Materials Portfolio for Next-generation Power Electronics and Semiconductor Advanced Packaging...
Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023,...
