PEMTRON Corporation, an inspection equipment developer and supplier, is proud to announce the opening of its new office, PEMTRON SE Asia Sdn. Bhd., strategically located in Penang, Malaysia. This expansion is a significant milestone for PEMTRON as it strengthens the company’s presence in the Southeast Asian region.

The new office is situated at No. 44-G Persiaran Bayan Bay, 11900 Bayan Lepas Pulau Pinang, Malaysia. This strategic location allows PEMTRON to better serve its growing customer base and enhance its support capabilities in the region.

To lead this expansion and foster strong relationships with customers in Southeast Asia, PEMTRON is pleased to introduce Zack Tan as Sales Director – S.E.A. Mr. Tan brings a wealth of experience and expertise to this role, having been in the electronic field since 1994. With over 23 years of experience in the Surface Mount Technology (SMT) industry, he has been specializing in 3D Solder Paste Inspection (SPI) and 3D Automated Optical Inspection (AOI) technologies since 2007.

zack tan pemtron

Throughout his career, Tan has been associated with several renowned brands, including Sindenshi, Nagoya, JUKI, Parmi, MIrtec and now PEMTRON. His extensive knowledge of the industry and these cutting-edge technologies make him a valuable addition to the PEMTRON team.

With the opening of its new office in Penang and the appointment of Mr. Tan as the Regional Manager, PEMTRON is poised to provide even more comprehensive support and solutions to its valued customers in Southeast Asia. The company remains committed to delivering top-notch electronic inspection solutions and strengthening its global presence.

Based on 3D precision measurement and vision source technology, PEMTRON develops equipment used in various fields such as SMT, Automotive Field, Lead Tab, Semiconductor, and supplies:-

Soldering Inspection equipment (3D SPI), 3D Mounting Inspection equipment (3D AOI, MOI), Conformal Coating Inspection equipment (TROI-8800 CI), Bottom Head Inspection equipment (Eagle 8800TH), Top & Bottom Double Sided Simultaneous Inspection equipment (Eagle 8800TWIN), Automated X-Ray SMD Counter (MERCURY), Wafer Sawing Before/After 3D Inspection equipment (8800 WI/WIR), Wire Bonding 3D Inspection & MEMS Auto Inspection equipment(ZEUS), Package AVI equipment (APOLLON), Memory Module / SSD Auto Inspection equipment (MARS),  FC-BGA, FCP-CSP Inspection equipment (POSEIDON-S), Scale Sorter Of FC-BGA Products (8800 FI), Bump Metal Mask Inspection equipment (8800 MI), PCB Appearance Inspection equipment (8800 AI) and Lead Tab Process/Inspection equipment(Hawk 7300).