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High-performance Inspection Gets Faster, Higher-quality Imaging with Iris™ 3D AOI Vision Technology from Mycronic
Mycronic, the leading global provider of flexible PCB assembly solutions, is releasing its next-generation vision technology for 3D Automated Optical Inspection. Part of the...
Aligned Solutions, Inc. Represents Super PCB in Parts of the Midwest
Super PCB, a single source for high quality printed circuit boards (PCBs), announced the appointment of Mike Young, Aligned Solutions, Inc. as its distributor...
ITW EAE Introduces Auto Exit Wing Feature for Electrovert® Wave Soldering Machines
ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match...
ZESTRON South Asia to Host Free Cleaning Webinar: ‘Impact of High Peak Reflow Temperature...
Zestron South Asia is pleased to announce that it will host “Impact of high peak reflow temperature on flux removal of high Pb solder...
Pacific Component Xchange Orders Hentec/RPS Pulsar Solderability Test System
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Pacific Component Xchange, Inc....
Transition Automation Improves Permalex Double-Edge Squeegee Assembly for Yamaha YSP
Transition Automation, Inc. today announces an update to its double-edge squeegee assembly for Yamaha YSP SMT printer platforms. The addition of end-anchor points to...
SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307
SHENMAO America, Inc. continues to innovate new solder pastes and is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The...
Nano Dimension and Essemtec Bring Innovation at Electronica
Witness Nano Dimension and Essemtec attention-grabbing demos of 3D AME NFC production on our DragonFly and FOX equipment at Electronica, Munich, Stand B1.507. Visit...
Setting Sail for New Horizons at This Year’s Viscom Technology Forum
Viscom AG’s Technology Forum has a reputation for offering participants wide-ranging content with valuable practical relevance in a compact format. Looking at the big...
Perfect Connection
The die-to-die bonding process Thermosonic Bonding (TSB) combines the novel thermocompression bonding with ultrasonic welding (UW).
Ultrasonic welding can reduce bonding pressure and temperature. This...
