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Cost savings and material flow optimization in electronics manufacturing through smart material management solutions...
Since 1967, Hardmeier Electronics AG has been developing and producing innovative electronic devices and systems for measurement, control, and regulation technology. Within the Hardmeier...
New structural adhesive offers temperature stability four times that of other adhesives in its...
DELO has launched an adhesive with exceptionally high temperature stability. DELO MONOPOX HT2999 achieves strengths of 20 MPa at 180 °C. This is four...
MIPI Specifications and Testing
The mobile industry processor interface (MIPI®) standard defines industry specifications for the design of mobile devices such as smartphones, tablets, laptops and hybrid devices....
The Michael Ziegler PRIDE Industries Foundation Awarded Grant by the Hearst Foundations
The Michael Ziegler PRIDE Industries Foundation was recently awarded a $75,000 grant by the Hearst Foundations to help fund its I AM ABLE employment helpline.
“We...
New kolb Cleaning Technology Distribution Partner in Switzerland
Delsys AG will be the sole sales partner for kolb Cleaning Technology products in Switzerland from 1 March 2023.
Delsys, as a trading and service...
Interview with Bill Capen
Bill Capen, Sr. Engineering Technical Specialist at Honeywell, is an industry guru. With more than 34 years in the industry, Bill has gained unparalleled...
Industry Reconnects as IPC APEX EXPO 2022 Reconvenes as In-person Event
From revolutionary innovations displayed on the show floor to expert insights conveyed in technical conference sessions, professional development courses and standards development committee meetings,...
Koh Young Sharing its Inspection Perspective on EV Testing Applications and Standards during...
Atlanta, Georgia – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will share its perspective on test standards, systems, and...
Thermal Shock Temperature Lifetime Modeling of Large Area Sintered Silver Baseplate Modules
Abstract—This study investigates the potential of novel large-area sintered silver pastes for establishing highly reliable interconnections between baseplates and metallic ceramic substrates such as...
Nano Dimension and Essemtec Bring Innovation at Electronica
Witness Nano Dimension and Essemtec attention-grabbing demos of 3D AME NFC production on our DragonFly and FOX equipment at Electronica, Munich, Stand B1.507. Visit...
