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IPC Launches Exclusive “Foreign Object Debris for Electronics Manufacturing” Course for Members
IPC, the leading association for electronics manufacturing, announces the launch of its new course titled "Foreign Object Debris (FOD) for Electronics Manufacturing," exclusively available...
Wafer-Level Packaging Symposium Program Announced
The SMTA is excited to announce the technical program for the Wafer-Level Packaging Symposium. The symposium will be held February 13-15, 2024 at The...
Technology Days 2024 at Rehm: #opentochange – Exploring New Horizons and Driving Innovation –...
“The only constant is change” – this is particularly true in electronics manufacturing. In an industry that is constantly evolving and changing, it is...
Rehm Technology Days 2023 – an in-house trade fair
The in-house Technology Days event is a tradition at Rehm. Yet this year it reached a new level. On the occasion of its 33rd...
IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington,...
WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held...
