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IPC Launches Exclusive “Foreign Object Debris for Electronics Manufacturing” Course for Members
IPC, the leading association for electronics manufacturing, announces the launch of its new course titled "Foreign Object Debris (FOD) for Electronics Manufacturing," exclusively available...
Wafer-Level Packaging Symposium Program Announced
The SMTA is excited to announce the technical program for the Wafer-Level Packaging Symposium. The symposium will be held February 13-15, 2024 at The...
SMTA Bangalore Hosts Electronics Manufacturing & Assembly Workshop
The Bangalore Chapter of SMTA is pleased to announce their hosting of a one-day Electronics Manufacturing & Assembly Workshop. This workshop will take place...
AIM to Speak at SMTA Long Island In-Person Technical Meeting
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA...
Rehm Technology Days 2023 – an in-house trade fair
The in-house Technology Days event is a tradition at Rehm. Yet this year it reached a new level. On the occasion of its 33rd...
IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington,...
