KIC SPS and X5 thermal profilers with Fan Speed Prediction software displayed at SMTA International 2026

KIC’s SPS and X5 Profilers with Fan Speed Prediction Honored with 2026 Global Technology...

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KIC, experts in electronics assembly thermal process temperature profiling and monitoring, is proud to announce that its SPS and X5 Profilers featuring Fan Speed...
FUJI Corporation Automated Nozzle Supply Unit integrated with NXTR A SMT placement platform

FUJI Corporation’s Automated Nozzle Setup and Changeover Earns a 2026 Global Technology Award

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FUJI Corporation is pleased to announce that its Automated Nozzle Setup and Changeover solution for the NXTR A platform received a 2026 Global Technology...
Global Electronics Assiciation

North American EMS Orders Climb Despite Lower September Shipments

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The Global Electronics Association announced today the September 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands...
NEPCON ASIA 2026 exhibition hall at Shenzhen World Exhibition and Convention Center with global electronics manufacturing exhibitors

NEPCON ASIA 2026 – Where Global Electronics Manufacturers Source Next-Gen Production Solutions

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Driven by booming AI‑led innovation, advanced packaging evolution and global supply‑chain realignment, the electronics manufacturing industry is undergoing profound transformation, with Asia accounting for...
Indium Corporation assistant product manager presenting on compressible metal thermal interface materials at TestConX China 2026

Indium Corporation Expert to Explore Factors Driving Performance of Compressible Metal TIMs at TestConX...

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Indium Corporation® Assistant Product Manager Foo Siang Hooi will discuss the critical factors that influence the performance of compressible metal thermal interface materials (TIMs)...
Bold Laser Automation LPC1010CO2 laser precision cutting and drilling platform for PCB and electronic materials

New CO2 Laser Cutting and Drilling Platform Enhances PCB and Electronic Materials Manufacturing

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Bold Laser Automation has introduced the LPC1010CO2 Laser Precision Cutting and Drilling Platform, a high-performance manufacturing system designed for precision drilling, skiving, cutting, trimming,...
GÖPEL electronic Video Dragon frame grabber and Microchip Technology ASA-ML SerDes chips for automotive video testing

GÖPEL electronic and Microchip Technology Collaborate to Expand the ASA-ML Ecosystem into Automotive Video...

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GÖPEL electronic and Microchip Technology, a broadline supplier of semiconductors, are deepening their collaboration in the field of ASA Motion Link (ASA-ML). GÖPEL electronic...
Microchip Technology PIC64-HPSC High-Performance Spaceflight Computing Series processor for space missions

Microchip Achieves Key Program Milestones for its PIC64-HPSC Spaceflight Computing Series

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Early radiation results and customer evaluations show progress toward high-performance computing for next-generation space missions. As civil, commercial, scientific and defense spacecraft become more...
Epec Engineered Technologies acquires Standard Printed Circuits, expanding U.S. PCB manufacturing capabilities

Epec Acquires Standard Printed Circuits, Expanding U.S. PCB Manufacturing Capabilities

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Standard Printed Circuits and Epec Engineered Technologies announce that Epec has completed the acquisition of Standard Printed Circuits, further expanding Epec's domestic manufacturing footprint...
Essemtec ribbon-cutting ceremony at new U.S. headquarters and demo center in Woburn, Massachusetts

Essemtec Opens New U.S. Headquarters and Advanced Demo Center in Greater Boston

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Essemtec, a global leader in adaptive and highly flexible SMT pick-and-place and dispensing equipment, with industry-leading All-in-One solutions combining jetting, placement, and inspection within...
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