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AIM Announces New Halogen-Free No Clean Solder Paste, H10
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the release of its newest halogen-free...
New kolb Cleaning Technology Distribution Partner in Switzerland
Delsys AG will be the sole sales partner for kolb Cleaning Technology products in Switzerland from 1 March 2023.
Delsys, as a trading and service...
Seika Machinery Promotes Michelle Ogihara to VP of Sales
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services is pleased to announce the promotion of Michelle Ogihara to Vice...
STI Electronics, Inc. Hires Gina Ploeg as SMT Assembly Technician
STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototype development and contract PCB assembly, announces Gina Ploeg has been...
Emil Otto Launches Product Campaign with New Green Line Fluxes and Concentrates
The German flux specialist Emil Otto GmbH has planned a number of product innovations for the year 2023. The product campaign will start with...
AIM Announces Promotion of Oscar Lopez to National Sales Manager of Mexico and Latin...
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the promotion of Oscar Lopez to...
STI Welcomes Lainee Moore-Manning as an Engineering Intern
STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototype development, and contract PCB assembly, welcomes Lainee Moore-Manning as...
A New Era of Mobility: Heraeus Electronics Launches New Innolot® 2.0 Solder Paste
Heraeus Electronics is pleased to announce the release of its new Microbond® SMT660 Innolot® 2.0 no-clean printing T4 solder paste. The new high reliability,...
SHENMAO Offers Low-Temperature Lead-Free Solder Paste PF735-PQ10-10L for High-Speed Printing
SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and...
Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX
Indium Corporation® will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 5-8 in Mesa, Ariz., U.S.
As an industry...
