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YINCAE Launches Diamond Underfill UF 158D with 8 W/m·K Thermal Conductivity
YINCAE, a leader in advanced electronic materials, has introduced Diamond Underfill UF 158D, delivering 8 W/m·K thermal conductivity—a new standard in heat dissipation for...
Indium Corporation Expert to Present on Innovative Thermal Management Solution at IMAPS Thermal Conference
Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on a new liquid metal containment method for thermal...
Hedi Bessrour Joins Emil Otto’s International Sales Team
Emil Otto GmbH is expanding its international sales team with the signing of Hedi Bessrour. Bessrour has been appointed as the new International Sales...
KYZEN to Showcase Process Reliability Solutions at SMTA International 2025
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit in Booth 2427 at SMTA International 2025, taking place October 21–23 at...
KYZEN’s Eco-Friendly CYBERSOLV® 141-K Named Best in Class at 2025 Mexico Technology Awards
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its innovative solvent cleaner, CYBERSOLV® 141-K, has won a...
DELO Validates Reliability of Adhesives in miniLED Connections, Paving Way for Scalable MicroLED Production
DELO has conducted extensive reliability tests on directional conductive adhesives, confirming their suitability as a robust alternative to solder in miniLED display manufacturing. The...
SHENMAO Introduces SMF-WC58 Water-Soluble Flux for Advanced Semiconductor Packaging
SHENMAO TECHNOLOGY is pleased to introduce SMF-WC58, a water-soluble, halogen-free tacky flux developed for ultra-fine bump pitch flip-chip and BGA/CSP attach processes.
SMF-WC58 provides strong...
YINCAE Showcases High-Performance Materials at IMAPS 2025
YINCAE, a global leader in advanced electronic materials, is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at...
AIM to Highlight M8 Solder Paste & Other Innovative Products at FIEE 2025
AIM Solder is pleased to announce its participation in the upcoming FIEE expo. This event takes place September 9-12 at the Sao Paulo Expo...
Innovative Adhesive Solutions From DELO Optimize First Lens Bonding in Camera Modules
DELO now offers two customized solutions for stabilizing camera modules that feature larger sensors and lenses. DELO DUALBOND SJ and DELO PHOTOBOND FB product...
