Indium Corporation to Feature Precision Gold Solder Solutions at MD&M West 2026

Indium Corporation to Feature Precision Gold Solder Solutions at MD&M West 2026

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, February 3-5, in Anaheim, Calif. AuLTRA® MediPro is a family...
AIM Solder Appoints Angel Lopez as Technical Support Engineer in North America

AIM Solder Appoints Angel Lopez as Technical Support Engineer in North America

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Angel Lopez as...
Indium Corporation

Indium Corporation to Highlight FAST Soldering Technology at NEPCON Japan 2026

Indium Corporation® will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo. The company will...
SHENMAO Launches High-Performance Jet Dispensing Solder Paste

SHENMAO Launches High-Performance Jet Dispensing Solder Paste

SHENMAO Technology, Inc. has introduced PF606-P266J, a high-performance solder paste engineered specifically for jet dispensing processes. Designed to meet the demands of next-generation, non-contact...
Indium Corporation Brings Precision Au-Based Die-Attach Preforms to SPIE Photonics West

Indium Corporation Brings Precision Au-Based Die-Attach Preforms to SPIE Photonics West

Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January 20-22, in San Francisco, California. Indium...
Microscreen Welcomes Industry Veteran Ed Nyhus as Sales Representative for the Northeast Region

Microscreen Welcomes Industry Veteran Ed Nyhus as Sales Representative for the Northeast Region

Microscreen, a U.S. manufacturer specializing in high-precision SMT solder stencils and custom tooling solutions, continues to expand its customer support network as demand grows...
YINCAE to Showcase Innovative Products at Wafer-Level Packaging Symposium

YINCAE to Showcase Innovative Products at Wafer-Level Packaging Symposium

YINCAE Advanced Materials, a leading supplier of high-performance materials for advanced semiconductor packaging, will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging...
SolderKing to Reinforce UK Manufacturing and Supply Reliability at Southern Manufacturing & Electronics 2026 Stand J90

SolderKing to Reinforce UK Manufacturing and Supply Reliability at Southern Manufacturing & Electronics...

With increased focus on supply chain resilience and consistent material performance across the electronics sector, UK-based solder consumables manufacturer SolderKing Assembly Materials Ltd will...
AIM Solder Signs New Distributor in Vietnam

AIM Solder Signs New Distributor in Vietnam

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the signing of RMG Vietnam Co.,...
Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability

Indium Corporation Launches New Solder Paste for High Print Consistency and Easy Cleanability

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated...