Kurtz Ersa Inc. will exhibit for the first time at the IMAPS Symposium 2026, held Sept. 29-Oct. 1 at Encore Boston Harbor – 1 Broadway, Everett, MA 02149. The company will host a tabletop display at the event and will focus on its comprehensive semiconductor product line developed for vacuum soldering, advanced packaging and microelectronics assembly.

The symposium marks a strategic expansion of Kurtz Ersa’s tradeshow presence into the dedicated semiconductor manufacturing community, complementing its established footprint at SMT and PCB assembly events.

The featured semicon family includes:

SRO i-LINE – An inline vacuum solder system sets the new standards in high-volume production and combines maximum efficiency with excellent process control. Engineered for mass production in semiconductor and microelectronics applications, the multi-chamber configuration allows for continuous 24/7 operation.

SRO-716 – A versatile vacuum soldering system designed for Formic Acid or Flux applications which offers precision and reliability for a wide range of process requirements and guarantees excellent results in the areas of vacuum soldering and brazing.

SRO-700 – A vacuum soldering platform suitable for both R&D and small batch production, providing controlled atmosphere processing for many sensitive applications.

SRO-GETTER – Is designed for R&D or production applications to seal packages with lids, while incorporating getter material to maintain a high vacuum over the lifetime of the device.

PEO-604 – A high performance quartz tube furnace tailored for semiconductor annealing, oxidation or polyimide processes, offering outstanding performance and versatility for demanding thermal applications. The PEO-604 is suited for R&D, pilot production and mass production environments.

Kurtz Ersa’s technical representatives will be on hand to discuss how the Semicon portfolio addresses void reduction, process stability and throughput requirements specific to semiconductor packaging, including power modules, IGBTs, SiC and GaN devices, and advanced BGA assemblies.

Further event details, including location and registration, are available through the IMAPS website.