Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed Circuit Board (PCB) Assembly Materials Marketing. This promotion reflects the company’s commitment to developing leadership talent while continuing to strengthen its customer focus and global market position.
In his expanded role, Bastecki will lead all customer-facing activities throughout the Americas, including sales, inside sales, and technical support. He will also continue to provide global leadership for Indium Corporation’s PCB Assembly Materials business, directing product management and marketing strategy for the company’s portfolio of solder paste, cored and solid wire, wave and selective solder fluxes, and bar solder products.
Since joining Indium Corporation in 2011 as Director of Electronic Assembly Materials, Bastecki has played a key role in driving the growth and success of the company’s PCB Assembly Materials business. Under his leadership, Indium Corporation has introduced numerous industry-leading technologies, including the award-winning Indium8.9HF solder paste platform, Durafuse® LT low-temperature solder technology, Durafuse® HR high-reliability solder technology, and the Indalloy®291 and Indalloy®302 low-silver alloy families.
Beyond product innovation, Bastecki has helped expand Indium Corporation’s global market position by aligning product strategy with emerging customer requirements, strengthening technical engagement, and fostering a culture focused on innovation, collaboration, and exceptional customer support. His leadership has contributed to significant market share growth while reinforcing Indium Corporation’s reputation as a trusted technology partner to electronics manufacturing worldwide.
Bastecki earned a bachelor’s degree in metallurgical engineering from the University of Pittsburgh and a master’s degree in business administration from Carnegie Mellon University. He is based in Atlanta, Georgia.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Mexico, Singapore, South Korea, the United Kingdom, and the U.S.
