Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announced that it has opened a state-of-the-art R&D and manufacturing facility.
TRI is committed to developing new technologies and inspection solutions for emerging markets, such as the Semiconductor and Advanced packaging. The facility will also offer dedicated Demo Rooms and a new space for Workshops and Seminars. The expansion substantially amplifies production capacity while conveniently positioned next to TRI’s existing manufacturing hub in Linkou, Taiwan.
TRI offers a One Stop Solution for PCB Assembly and Advanced Packaging Testing and Inspection, which includes 3D Solder Paste Inspection (SPI), 3D Automated Optical Inspection (AOI), 3D CT Automated X-ray Inspection (AXI) and High-Performance In-Circuit Testing (ICT). TRI’s solution portfolio has a wide range of high-end features and advanced functionality to meet current and future production line requirements.
Celebrating 35 years of Growing Together
Join us in celebrating 35 years of Growth Together! Throughout the year, TRI will showcase AI-powered Test and Inspection solutions at exhibitions and seminars. Our sustained success reflects a commitment to excellence and a journey of continuous Growth with our valued customers.
To learn more, visit www.tri.com.tw.
